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ARM: dts: Add CPU cooling binding for exynos3250 boards
This patch add the cooling device to control the overheating issue on Exynos3250-based Rinato/Monk board. Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com> Acked-by: Kyungmin Park <kyungmin.park@samsung.com> Acked-by Krzysztof Kozlowski <k.kozlowski@samsung.com> Signed-off-by: Kukjin Kim <kgene@kernel.org>
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3 changed files with 31 additions and 0 deletions
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@ -116,6 +116,21 @@ haptics {
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min-microvolt = <1100000>;
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max-microvolt = <2700000>;
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};
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thermal-zones {
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cpu_thermal: cpu-thermal {
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cooling-maps {
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map0 {
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/* Correspond to 500MHz at freq_table */
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cooling-device = <&cpu0 5 5>;
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};
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map1 {
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/* Correspond to 200MHz at freq_table */
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cooling-device = <&cpu0 8 8>;
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};
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};
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};
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};
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};
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&adc {
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@ -107,6 +107,21 @@ haptics {
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min-microvolt = <1100000>;
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max-microvolt = <2700000>;
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};
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thermal-zones {
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cpu_thermal: cpu-thermal {
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cooling-maps {
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map0 {
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/* Corresponds to 500MHz */
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cooling-device = <&cpu0 5 5>;
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};
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map1 {
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/* Corresponds to 200MHz */
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cooling-device = <&cpu0 8 8>;
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};
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};
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};
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};
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};
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&adc {
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@ -55,6 +55,7 @@ cpu0: cpu@0 {
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clock-frequency = <1000000000>;
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clocks = <&cmu CLK_ARM_CLK>;
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clock-names = "cpu";
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#cooling-cells = <2>;
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operating-points = <
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1000000 1150000
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