mirror of
https://git.kernel.org/pub/scm/linux/kernel/git/stable/linux.git
synced 2024-08-21 08:19:28 +00:00
thermal/x86_pkg_temp_thermal: Support multi-die/package
Package temperature sensors are actually implemented in hardware per-die. Thus, the new multi-die/package systems sport mulitple package thermal zones for each package. Update the x86_pkg_temp_thermal to be "multi-die-aware", so it can expose multiple zones per package, instead of just one. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Len Brown <len.brown@intel.com> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Reviewed-by: Ingo Molnar <mingo@kernel.org> Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org> Link: https://lkml.kernel.org/r/281695c854d38d3bdec803480c3049c36198ca44.1557769318.git.len.brown@intel.com
This commit is contained in:
parent
32fb480e0a
commit
724adec33c
1 changed files with 4 additions and 4 deletions
|
@ -122,7 +122,7 @@ static int pkg_temp_debugfs_init(void)
|
|||
*/
|
||||
static struct pkg_device *pkg_temp_thermal_get_dev(unsigned int cpu)
|
||||
{
|
||||
int pkgid = topology_logical_package_id(cpu);
|
||||
int pkgid = topology_logical_die_id(cpu);
|
||||
|
||||
if (pkgid >= 0 && pkgid < max_packages)
|
||||
return packages[pkgid];
|
||||
|
@ -353,7 +353,7 @@ static int pkg_thermal_notify(u64 msr_val)
|
|||
|
||||
static int pkg_temp_thermal_device_add(unsigned int cpu)
|
||||
{
|
||||
int pkgid = topology_logical_package_id(cpu);
|
||||
int pkgid = topology_logical_die_id(cpu);
|
||||
u32 tj_max, eax, ebx, ecx, edx;
|
||||
struct pkg_device *pkgdev;
|
||||
int thres_count, err;
|
||||
|
@ -449,7 +449,7 @@ static int pkg_thermal_cpu_offline(unsigned int cpu)
|
|||
* worker will see the package anymore.
|
||||
*/
|
||||
if (lastcpu) {
|
||||
packages[topology_logical_package_id(cpu)] = NULL;
|
||||
packages[topology_logical_die_id(cpu)] = NULL;
|
||||
/* After this point nothing touches the MSR anymore. */
|
||||
wrmsr(MSR_IA32_PACKAGE_THERM_INTERRUPT,
|
||||
pkgdev->msr_pkg_therm_low, pkgdev->msr_pkg_therm_high);
|
||||
|
@ -515,7 +515,7 @@ static int __init pkg_temp_thermal_init(void)
|
|||
if (!x86_match_cpu(pkg_temp_thermal_ids))
|
||||
return -ENODEV;
|
||||
|
||||
max_packages = topology_max_packages();
|
||||
max_packages = topology_max_packages() * topology_max_die_per_package();
|
||||
packages = kcalloc(max_packages, sizeof(struct pkg_device *),
|
||||
GFP_KERNEL);
|
||||
if (!packages)
|
||||
|
|
Loading…
Reference in a new issue