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usb: musb: make davinci and da8xx glues depend on BROKEN

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those two glues are still including <mach/>
headers and no active developement has been
going on those glues for quite some time.

Apparently, for da8xx glue, only initial commit
3ee076de (usb: musb: introduce DA8xx/OMAP-L1x
glue layer) has been tested. All other patches
seem to have been compile-tested only.

For davinci glue layer, last real commit dates
back from 2010, with commit f405387 (USB: MUSB:
fix kernel WARNING/oops when unloading module
in OTG mode).

Signed-off-by: Felipe Balbi <balbi@ti.com>
This commit is contained in:
Felipe Balbi 2013-02-06 09:24:55 +02:00
parent 99b7856f3c
commit 787f5627be
1 changed files with 2 additions and 0 deletions
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2
drivers/usb/musb/Kconfig
View file

@ -34,10 +34,12 @@ choice
config USB_MUSB_DAVINCI
tristate "DaVinci"
depends on ARCH_DAVINCI_DMx
depends on BROKEN
config USB_MUSB_DA8XX
tristate "DA8xx/OMAP-L1x"
depends on ARCH_DAVINCI_DA8XX
depends on BROKEN
config USB_MUSB_TUSB6010
tristate "TUSB6010"