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thermal: update kernel-doc for thermal_zone_bind_cooling_device

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This patch updates the documentation for thermal_zone_bind_cooling_device
and removes the warnings generated by scripts/kernel-doc -v.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This commit is contained in:
Eduardo Valentin 2013-04-23 21:48:16 +00:00 committed by Zhang Rui
parent 910cb1e34d
commit d2e4eb83e7
1 changed files with 13 additions and 3 deletions
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16
drivers/thermal/thermal_core.c
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@ -1109,13 +1109,23 @@ thermal_remove_hwmon_sysfs(struct thermal_zone_device *tz)
#endif
/**
* thermal_zone_bind_cooling_device - bind a cooling device to a thermal zone
* @tz: thermal zone device
* thermal_zone_bind_cooling_device() - bind a cooling device to a thermal zone
* @tz: pointer to struct thermal_zone_device
* @trip: indicates which trip point the cooling devices is
* associated with in this thermal zone.
* @cdev: thermal cooling device
* @cdev: pointer to struct thermal_cooling_device
* @upper: the Maximum cooling state for this trip point.
* THERMAL_NO_LIMIT means no upper limit,
* and the cooling device can be in max_state.
* @lower: the Minimum cooling state can be used for this trip point.
* THERMAL_NO_LIMIT means no lower limit,
* and the cooling device can be in cooling state 0.
*
* This interface function bind a thermal cooling device to the certain trip
* point of a thermal zone device.
* This function is usually called in the thermal zone device .bind callback.
*
* Return: 0 on success, the proper error value otherwise.
*/
int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
int trip,