Commit graph

117 commits

Author SHA1 Message Date
Linus Torvalds
a2013a13e6 Merge branch 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial
Pull trivial branch from Jiri Kosina:
 "Usual stuff -- comment/printk typo fixes, documentation updates, dead
  code elimination."

* 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial: (39 commits)
  HOWTO: fix double words typo
  x86 mtrr: fix comment typo in mtrr_bp_init
  propagate name change to comments in kernel source
  doc: Update the name of profiling based on sysfs
  treewide: Fix typos in various drivers
  treewide: Fix typos in various Kconfig
  wireless: mwifiex: Fix typo in wireless/mwifiex driver
  messages: i2o: Fix typo in messages/i2o
  scripts/kernel-doc: check that non-void fcts describe their return value
  Kernel-doc: Convention: Use a "Return" section to describe return values
  radeon: Fix typo and copy/paste error in comments
  doc: Remove unnecessary declarations from Documentation/accounting/getdelays.c
  various: Fix spelling of "asynchronous" in comments.
  Fix misspellings of "whether" in comments.
  eisa: Fix spelling of "asynchronous".
  various: Fix spelling of "registered" in comments.
  doc: fix quite a few typos within Documentation
  target: iscsi: fix comment typos in target/iscsi drivers
  treewide: fix typo of "suport" in various comments and Kconfig
  treewide: fix typo of "suppport" in various comments
  ...
2012-12-13 12:00:02 -08:00
Zhang Rui
1f53ef17d3 Thermal: Fix DEFAULT_THERMAL_GOVERNOR
Fix DEFAULT_THERMAL_GOVERNOR to be consistant with the
default governor selected in kernel config file.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-12-12 15:34:48 +08:00
Zhang Rui
d567c686ae Thermal: fix a NULL pointer dereference when generic thermal layer is built as a module
[   12.761956] BUG: unable to handle kernel NULL pointer dereference at 0000000000000018
[   12.762016] IP: [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys]
[   12.762060] PGD 1fec74067 PUD 1fee5b067 PMD 0
[   12.762127] Oops: 0000 [#1] SMP
[   12.762177] Modules linked in: hid_generic crc32c_intel usbhid hid firewire_ohci(+) e1000e(+) firewire_core crc_itu_t xhci_hcd(+) thermal(+) fan thermal_sys hwmon
[   12.762423] CPU 1
[   12.762443] Pid: 187, comm: modprobe Tainted: G       A     3.7.0-thermal-module+ #25                  /DH77DF
[   12.762496] RIP: 0010:[<ffffffffa0005277>]  [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys]
[   12.762682] RSP: 0018:ffff8801fe7ddc18  EFLAGS: 00010282
[   12.762704] RAX: 0000000000000000 RBX: ffff8801ff3e9c00 RCX: ffff8801fdc39800
[   12.762728] RDX: ffff8801fe7ddc24 RSI: 0000000000000001 RDI: ffff8801ff3e9c00
[   12.762764] RBP: ffff8801fe7ddc48 R08: 0000000004000000 R09: ffffffffa001f568
[   12.762797] R10: ffffffff81363083 R11: 0000000000000001 R12: 0000000000000001
[   12.762832] R13: 0000000000000000 R14: 0000000000000001 R15: ffff8801fde73e68
[   12.762866] FS:  00007f5548516700(0000) GS:ffff88021f240000(0000) knlGS:0000000000000000
[   12.762912] CS:  0010 DS: 0000 ES: 0000 CR0: 0000000080050033
[   12.762946] CR2: 0000000000000018 CR3: 00000001fefe2000 CR4: 00000000001407e0
[   12.762979] DR0: 0000000000000000 DR1: 0000000000000000 DR2: 0000000000000000
[   12.763014] DR3: 0000000000000000 DR6: 00000000ffff0ff0 DR7: 0000000000000400
[   12.763048] Process modprobe (pid: 187, threadinfo ffff8801fe7dc000, task ffff8801fe5bdb40)
[   12.763095] Stack:
[   12.763122]  0000000000019640 00000000fdc39800 ffff8801fe7ddc48 ffff8801ff3e9c00
[   12.763225]  0000000000000002 0000000000000000 ffff8801fe7ddc78 ffffffffa00053e7
[   12.763338]  ffff8801ff3e9c00 0000000000006c98 ffffffffa0007480 ffff8801ff3e9c00
[   12.763440] Call Trace:
[   12.763470]  [<ffffffffa00053e7>] thermal_zone_device_update+0x77/0xa0 [thermal_sys]
[   12.763515]  [<ffffffffa0006d38>] thermal_zone_device_register+0x788/0xa88 [thermal_sys]
[   12.763562]  [<ffffffffa001f394>] acpi_thermal_add+0x360/0x4c8 [thermal]
[   12.763598]  [<ffffffff8133902a>] acpi_device_probe+0x50/0x190
[   12.763632]  [<ffffffff811bd793>] ? sysfs_create_link+0x13/0x20
[   12.763666]  [<ffffffff813cc41b>] driver_probe_device+0x7b/0x240
[   12.763699]  [<ffffffff813cc68b>] __driver_attach+0xab/0xb0
[   12.763732]  [<ffffffff813cc5e0>] ? driver_probe_device+0x240/0x240
[   12.763766]  [<ffffffff813ca836>] bus_for_each_dev+0x56/0x90
[   12.763799]  [<ffffffff813cbf4e>] driver_attach+0x1e/0x20
[   12.763831]  [<ffffffff813cbac0>] bus_add_driver+0x190/0x290
[   12.763864]  [<ffffffffa0022000>] ? 0xffffffffa0021fff
[   12.763896]  [<ffffffff813ccbea>] driver_register+0x7a/0x160
[   12.763928]  [<ffffffffa0022000>] ? 0xffffffffa0021fff
[   12.763960]  [<ffffffff813399fb>] acpi_bus_register_driver+0x43/0x45
[   12.763995]  [<ffffffffa002203a>] acpi_thermal_init+0x3a/0x42 [thermal]
[   12.764029]  [<ffffffff8100207f>] do_one_initcall+0x3f/0x170
[   12.764063]  [<ffffffff810b1a5f>] sys_init_module+0x8f/0x200
[   12.764097]  [<ffffffff815ff259>] system_call_fastpath+0x16/0x1b
[   12.764129] Code: 48 8b 87 c8 02 00 00 41 89 f4 48 8d 55 dc ff 50 28 44 8b 6d dc 41 8d 45 fe 83 f8 01 76 5e 48 8b 83 d8 02 00 00 44 89 e6 48 89 df <ff> 50 18 4c 8d a3 10 03 00 00 4c 89 e7 e8 87 f1 5e e1 8b 83 bc
[   12.765164] RIP  [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys]
[   12.765223]  RSP <ffff8801fe7ddc18>
[   12.765252] CR2: 0000000000000018
[   12.765284] ---[ end trace 7723294cdfb00d2a ]---

This is because thermal_zone_device_update() is invoked before
any thermal governors being registered.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-12-12 15:23:54 +08:00
Masanari Iida
e41e85cc17 treewide: Fix typos in various Kconfig
Correct spelling typo within various Kconfig.

Signed-off-by: Masanari Iida <standby24x7@gmail.com>
Signed-off-by: Jiri Kosina <jkosina@suse.cz>
2012-12-03 11:03:56 +01:00
Kuninori Morimoto
d12250ef8d thermal: rcar: add rcar_zone_to_priv() macro
This patch adds rcar_zone_to_priv()
which is a helper macro for gettign private data.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-26 11:03:55 +08:00
Kuninori Morimoto
c499703e64 thermal: rcar: fixup the unit of temperature
The unit of temperature is Milli-Celsius.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-26 11:03:45 +08:00
Eduardo Valentin
4ba115b1e1 thermal: cpu cooling: allow module builds
As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
  generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y

with the following drive:
CONFIG_OMAP_BANDGAP=m

generates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!

This patch changes cpu cooling driver to allow it
to be built as module.

Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-22 15:59:52 +08:00
Eduardo Valentin
3778ff5c70 thermal: cpu cooling: use const parameter while registering
There are predefined cpu_masks that are const data structures.
This patch changes the cpu cooling register function so that
those const cpu_masks can be used, without compilation warnings.

include/linux/cpumask.h

 * The following particular system cpumasks and operations manage
 * possible, present, active and online cpus.
 *
 *     cpu_possible_mask- has bit 'cpu' set iff cpu is populatable
 *     cpu_present_mask - has bit 'cpu' set iff cpu is populated
 *     cpu_online_mask  - has bit 'cpu' set iff cpu available to scheduler
 *     cpu_active_mask  - has bit 'cpu' set iff cpu available to migration
 *

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-22 15:59:47 +08:00
hongbo.zhang
aa1acb0451 Thermal: Add ST-Ericsson DB8500 thermal driver.
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically.  The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:50:34 +08:00
Zhang Rui
445110e9d0 drivers/thermal/Makefile refactor
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:47 +08:00
Zhang Rui
ec54c74c8f Exynos: Add missing dependency
CPU_FREQ_TABLE depends on CPU_FREQ. Selecting CPU_FREQ_TABLE without checking
for dependencies gives the following compilation warnings:
warning: (ARCH_TEGRA_2x_SOC && ARCH_TEGRA_3x_SOC && UX500_SOC_DB8500 &&
CPU_THERMAL && EXYNOS_THERMAL) selects CPU_FREQ_TABLE which has unmet
direct dependencies (ARCH_HAS_CPUFREQ && CPU_FREQ)

Based-on-patch-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:46 +08:00
Zhang Rui
72e1989782 Refactor drivers/thermal/Kconfig
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:30 +08:00
Sachin Kamat
a0f846c23c thermal: cpu_cooling: Make 'notify_device' static
Silences the following sparse warning:

drivers/thermal/cpu_cooling.c:67:31: warning:
symbol 'notify_device' was not declared. Should it be static?

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 16:48:40 +08:00
hongbo.zhang
160b7d8048 Thermal: Remove the cooling_cpufreq_list.
Problem of using this list is that the cpufreq_get_max_state callback will be
called when register cooling device by thermal_cooling_device_register, but
this list isn't ready at this moment. What's more, there is no need to maintain
such a list, we can get cpufreq_cooling_device instance by the private
thermal_cooling_device.devdata.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-07 14:52:27 +08:00
hongbo.zhang
9c51b05a78 Thermal: fix bug of counting cpu frequencies.
In the while loop for counting cpu frequencies, if table[i].frequency equals
CPUFREQ_ENTRY_INVALID, index i won't be increased, so this leads to an endless
loop, what's more the index i cannot be referred as cpu frequencies number if
there is CPUFREQ_ENTRY_INVALID case.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-07 14:49:43 +08:00
hongbo.zhang
6b6519df84 Thermal: add indent for code alignment.
The curly bracket should be aligned with corresponding if else statements.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-07 14:49:25 +08:00
Kuninori Morimoto
4e8e2f644e thermal: rcar_thermal: remove explicitly used devm_kfree/iounap()
devm_kfree and devm_iounmap should not have to be explicitly used

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-07 11:35:46 +08:00
Sachin Kamat
e15cb14493 thermal: user_space: Add missing static storage class specifiers
Fixes the following sparse warnings:
drivers/thermal/user_space.c:38:5: warning:
symbol 'notify_user_space' was not declared. Should it be static?
drivers/thermal/user_space.c:46:25: warning:
symbol 'thermal_gov_user_space' was not declared. Should it be static?

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:11 +08:00
Sachin Kamat
621769334b thermal: fair_share: Add missing static storage class specifiers
Fixes the following sparse warnings:
drivers/thermal/fair_share.c:80:5: warning:
symbol 'fair_share_throttle' was not declared. Should it be static?
drivers/thermal/fair_share.c:111:25: warning:
symbol 'thermal_gov_fair_share' was not declared. Should it be static?

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:10 +08:00
Sachin Kamat
b88a497701 thermal: step_wise: Add missing static storage class specifiers
Fixes the following sparse warnings:
drivers/thermal/step_wise.c:153:5: warning:
symbol 'step_wise_throttle' was not declared. Should it be static?
drivers/thermal/step_wise.c:172:25: warning:
symbol 'thermal_gov_step_wise' was not declared. Should it be static?

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:10 +08:00
Hugh Dickins
791700cdfc Thermal: Fix oops and unlocking in thermal_sys.c
This patch fixes the following mutex and NULL pointer
problems in thermal_sys.c:

 * mutex_unlock fix in update_temperature function
 * mutex_unlock fix in bind_cdev function
 * Correct early return to continue in bind_cdev function
 * NULL check fix in bind_cdev function
 * NULL check fix in bind_tz function

Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Reported-by: Sedat Dilek <sedat.dilek@gmail.com>
Reported-by: Hugh Dickins <hughd@google.com>
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Sedat Dilek <sedat.dilek@gmail.com>
Signed-off-by: Hugh Dickins <hughd@google.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:10 +08:00
Durgadoss R
a56757af8e Thermal: Provide option to choose default thermal governor
This patch provides option to choose the default thermal
governor. If no option is provided, the step_wise
governor is selected by default.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:09 +08:00
Durgadoss R
f2b4caafd4 Thermal: Add a notification API
This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R
0c01ebbfd3 Thermal: Remove throttling logic out of thermal_sys.c
This patch removes the throttling logic out of
thermal_sys.c; also refactors the code into smaller
functions so that are easy to read/maintain.
 * Seperates the handling of critical and non-critical trips
 * Re-arranges the set_polling and device_check methods, so
   that all related functions are arranged in one place.
 * Removes the 'do_update' and 'trip_update' method, as part
   of moving the throttling logic out of thermal_sys.c

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R
1cc807a234 Thermal: Add a thermal notifier for user space
This patch registers a governor which will let the
user land manage the platform thermals. Whenever a
trip happens, this governor just notifies the user
space using kobj_uevent().

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R
e151a202a0 Thermal: Introduce a step_wise thermal governor
This patch adds a simple step_wise governor to the
generic thermal layer. This algorithm throttles the
cooling devices in a linear fashion. If the 'trend'
is heating, it throttles by one step. And if the
thermal trend is cooling it de-throttles by one step.

This actually moves the throttling logic from thermal_sys.c
and puts inside step_wise.c, without any change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
Durgadoss R
4ccc5743ae Thermal: Introduce fair_share thermal governor
This patch introduces a simple 'weight' based
governor named fair_share governor. Whenever the
thermal framework gets notified of the trip point
violation, this governor (if configured), throttles
the cooling devices associated with a thermal zone.

This mapping between a thermal zone and a cooling device
and the effectiveness of cooling are provided in the
platform layer.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
Durgadoss R
dc76548269 Thermal: Make thermal_cdev_update as a global function
This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:06 +08:00
Durgadoss R
7e8ee1e9d7 Thermal: Update binding logic based on platform data
This patch updates the binding logic in thermal_sys.c
It uses the platform layer data to bind a thermal zone
to a cdev for a particular trip point.

 * If we do not have platform data and do not have
   .bind defined, do not bind.
 * If we do not have platform data but .bind is
   defined, then use tz->ops->bind.
 * If we have platform data, use it to create binding.

The same logic sequence is followed for unbind also.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:06 +08:00
Durgadoss R
5a2c090b33 Thermal: Add a policy sysfs attribute
This patch adds a policy sysfs attribute to a thermal zone.
This attribute denotes the throttling governor used for the
zone. This is a RW attribute.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:05 +08:00
Durgadoss R
a4a15485fb Thermal: Add thermal governor registration APIs
This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:05 +08:00
Durgadoss R
50125a9b27 Thermal: Pass zone parameters as argument to tzd_register
This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:59:57 +08:00
Durgadoss R
9b4298a088 Thermal: Add get trend, get instance API's to thermal_sys
This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
 * get_tz_trend: obtain the trend of the given thermal zone
 * get_thermal_instance: obtain the instance corresponding
   to the given tz, cdev and the trip point.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:56:32 +08:00
Durgadoss R
71350db43b Thermal: Move thermal_instance to thermal_core.h
This patch creates a thermal_core.h file which can contain
all defines used by the core thermal framework files. For
now, move the thermal_instance structure to thermal_core.h
This structure is used by files under drivers/thermal/.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:56:32 +08:00
Jonghwan Choi
3ae53b1e13 exynos4_tmu_driver_ids should be exynos_tmu_driver_ids.
Signed-off-by: Jonghwan Choi <jhbird.choi@samsung.com>
Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-03 09:52:55 +08:00
Devendra Naga
608f62b996 thermal: solve compilation errors in rcar_thermal
following were the errors reported

drivers/thermal/rcar_thermal.c: In function ‘rcar_thermal_probe’:
drivers/thermal/rcar_thermal.c:214:10: warning: passing argument 3 of ‘thermal_zone_device_register’ makes integer from pointer without a cast [enabled by default]
include/linux/thermal.h:166:29: note: expected ‘int’ but argument is of type ‘struct rcar_thermal_priv *’
drivers/thermal/rcar_thermal.c:214:10: error: too few arguments to function ‘thermal_zone_device_register’
include/linux/thermal.h:166:29: note: declared here
make[1]: *** [drivers/thermal/rcar_thermal.o] Error 1
make: *** [drivers/thermal/rcar_thermal.o] Error 2

with gcc version 4.6.3 (Ubuntu/Linaro 4.6.3-1ubuntu5)

Signed-off-by: Devendra Naga <develkernel412222@gmail.com>
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-03 09:52:48 +08:00
David Rientjes
dd8e8c4a2c thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configured
Commit 0236141837 ("thermal: add generic cpufreq cooling
implementation") requires cpufreq_frequency_get_table(), but that
function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the
following build error:

  drivers/built-in.o: In function `cpufreq_get_max_state':
  drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table'
  drivers/built-in.o: In function `get_cpu_frequency':
  drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table'

Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration.

It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so
select it there as well.

Signed-off-by: David Rientjes <rientjes@google.com>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-15 14:00:07 -07:00
Len Brown
29b19e2504 Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts:
	drivers/staging/omap-thermal/omap-thermal-common.
		OMAP supplied dummy TC1 and TC2,
		at the same time that the thermal tree removed them
		from thermal_zone_device_register()

	drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
		propogate the upstream MAX_IDR_LEVEL re-name
			to prevent a build failure

	Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>

Signed-off-by: Len Brown <len.brown@intel.com>
2012-10-09 01:35:52 -04:00
Fengguang Wu
125c4c706b idr: rename MAX_LEVEL to MAX_IDR_LEVEL
To avoid name conflicts:

  drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined

While at it, also make the other names more consistent and add
parentheses.

[akpm@linux-foundation.org: repair fallout]
[sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change]
Signed-off-by: Fengguang Wu <fengguang.wu@intel.com>
Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at>
Cc: walter harms <wharms@bfs.de>
Cc: Glauber Costa <glommer@parallels.com>
Signed-off-by: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Roland Dreier <roland@purestorage.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-06 03:04:56 +09:00
Sachin Kamat
c072fed95c thermal: Exynos: Fix NULL pointer dereference in exynos_unregister_thermal()
exynos_unregister_thermal() is functional only when 'th_zone' is not
NULL (ensured by the NULL checks). However, in the event it is NULL, it
gets dereferenced in the for loop. This patch fixes this issue.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
2012-09-28 08:23:21 +08:00
Jonghwa Lee
a4b6fec977 Thermal: Fix bug on cpu_cooling, cooling device's id conflict problem.
This patch fixes small bug on cpu_cooling. CPU cooling device has own
id generated with idr mathod. However in the previous version, it swapped
to all same id at last stage of probing as 0. This makes id's collision and
also occures error when it releases that id.

Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
2012-09-27 14:11:22 +08:00
Amit Daniel Kachhap
79e093c3fe thermal: exynos: Use devm_* functions
devm_* functions are used to replace kzalloc, request_mem_region, ioremap
and request_irq functions in probe call. With the usage of devm_* functions
explicit freeing and unmapping is not required.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Sachin Kamat <sachin.kamat@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
17be868e04 ARM: exynos: add thermal sensor driver platform data support
Add necessary default platform data support needed for TMU driver.  The
supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms and only compile tested for exynos4412.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: jonghwa lee <jonghwa3.lee@samsung.com>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
7e0b55e606 thermal: exynos: register the tmu sensor with the kernel thermal layer
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform.  This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
f22d9c03cc thermal: exynos5: add exynos5250 thermal sensor driver support
Insert exynos5 TMU sensor changes into the thermal driver.  Some exynos4
changes are made generic for exynos series.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
c48cbba6fe hwmon: exynos4: move thermal sensor driver to driver/thermal directory
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap
0236141837 thermal: add generic cpufreq cooling implementation
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Guenter Roeck
204dd1d39c thermal: Fix potential NULL pointer accesses
The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.

This patch addresses Coverity #102180 and #102182: Dereference before null check

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Kuninori Morimoto
1e426ffddf thermal: add Renesas R-Car thermal sensor support
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:37 +08:00
Guenter Roeck
79a49168b5 thermal: fix potential out-of-bounds memory access
temp_crit.name and temp_input.name have a length of 16 bytes.  Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses.  Replace it with sizeof().

Addresses Coverity #115679

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:37 +08:00