Pull thermal management updates from Zhang Rui:
"Sorry that I missed the merge window as there is a bug found in the
last minute, and I have to fix it and wait for the code to be tested
in linux-next tree for a few days. Now the buggy patch has been
dropped entirely from my next branch. Thus I hope those changes can
still be merged in 3.18-rc2 as most of them are platform thermal
driver changes.
Specifics:
- introduce ACPI INT340X thermal drivers.
Newer laptops and tablets may have thermal sensors and other
devices with thermal control capabilities that are exposed for the
OS to use via the ACPI INT340x device objects. Several drivers are
introduced to expose the temperature information and cooling
ability from these objects to user-space via the normal thermal
framework.
From: Lu Aaron, Lan Tianyu, Jacob Pan and Zhang Rui.
- introduce a new thermal governor, which just uses a hysteresis to
switch abruptly on/off a cooling device. This governor can be used
to control certain fan devices that can not be throttled but just
switched on or off. From: Peter Feuerer.
- introduce support for some new thermal interrupt functions on
i.MX6SX, in IMX thermal driver. From: Anson, Huang.
- introduce tracing support on thermal framework. From: Punit
Agrawal.
- small fixes in OF thermal and thermal step_wise governor"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
Thermal: int340x thermal: select ACPI fan driver
Thermal: int3400_thermal: use acpi_thermal_rel parsing APIs
Thermal: int340x_thermal: expose acpi thermal relationship tables
Thermal: introduce int3403 thermal driver
Thermal: introduce INT3402 thermal driver
Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.h
ACPI / Fan: support INT3404 thermal device
ACPI / Fan: add ACPI 4.0 style fan support
ACPI / fan: convert to platform driver
ACPI / fan: use acpi_device_xxx_power instead of acpi_bus equivelant
ACPI / fan: remove no need check for device pointer
ACPI / fan: remove unused macro
Thermal: int3400 thermal: register to thermal framework
Thermal: int3400 thermal: add capability to detect supporting UUIDs
Thermal: introduce int3400 thermal driver
ACPI: add ACPI_TYPE_LOCAL_REFERENCE support to acpi_extract_package()
ACPI: make acpi_create_platform_device() an external API
thermal: step_wise: fix: Prevent from binary overflow when trend is dropping
ACPI: introduce ACPI int340x thermal scan handler
thermal: Added Bang-bang thermal governor
...
we share the same driver for both ACPI predefined Fan device
and INT3404 Fan device, thus we should select the ACPI Fan
driver when int340x thermal drivers are enabeld.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The kernel used to contain two functions for length-delimited,
case-insensitive string comparison, strnicmp with correct semantics and
a slightly buggy strncasecmp. The latter is the POSIX name, so strnicmp
was renamed to strncasecmp, and strnicmp made into a wrapper for the new
strncasecmp to avoid breaking existing users.
To allow the compat wrapper strnicmp to be removed at some point in the
future, and to avoid the extra indirection cost, do
s/strnicmp/strncasecmp/g.
Signed-off-by: Rasmus Villemoes <linux@rasmusvillemoes.dk>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
ACPI _TRT and _ART parsing code has been moved to acpi_thermal_rel such
that it can be used by other devices in the future. Use the parsing APIs
in acpi_thermal_rel.c instead.
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
ACPI 4.0 introduced two thermal relationship tables via _ART
(active cooling) and _TRT (passive cooling) objects. These
tables contain many to many relationships among thermal sensors
and cooling devices.
This patch parses _ART and _TRT and makes the result available to
the userspace via an misc device interface. At the same time,
kernel drivers can also request parsing results from internal
kernel APIs.
The results include source and target devices, influence, and
sampling rate in case of _TRT. For _ART, the result shows source
device, target device, and weight percentage.
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.
The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.
Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
ACPI INT3402 device object could report temperature for the memory module.
To expose such information to user space, a thermal zone device is registered
for it so that the thermal sysfs interface can expose such information for
userspace to use.
Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
It turns out that some boards can have instance->lower greater than 0 and
when thermal trend is dropping it results with next_target equal to -1.
Since the next_target is defined as unsigned long it is interpreted as
0xFFFFFFFF and larger than instance->upper.
As a result the next_target is set to instance->upper which ramps up to
maximal cooling device target when the temperature is steadily decreasing.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Newer laptops and tablets that use ACPI may have thermal sensors and
other devices with thermal control capabilities outside the core CPU/SOC,
for thermal safety reasons.
They are exposed for the OS to use via
1) INT3400 ACPI device object as the master.
2) INT3401 ~ INT340B ACPI device objects as the slaves.
This patch introduces a scan handler to enumerate the INT3400
ACPI device object to platform bus, and prevent its slaves
from being enumerated before the controller driver being probed.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
mach-kirkwood has been removed, now that kirkwood lives in mach-mvebu.
Depend on MACH_KIRKWOOD, which will be set when kirkwood is built as
part of ARCH_MVEBU.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Link: https://lkml.kernel.org/r/1409417172-6846-4-git-send-email-andrew@lunn.ch
Signed-off-by: Jason Cooper <jason@lakedaemon.net>
The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device. It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only. For those special devices the driver needs to
explicitely request it.
Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
i.MX6SX has some new features of thermal interrupt function,
there are LOW, HIGH and PANIC irq for thermal sensor, so add
platform data to separate different thermal version;
The reset value of LOW ALARM is 0 which means the highest
temp, so the LOW ALARM will be triggered once irq is enabled,
so we need to correct it before enabling thermal irq;
Enable PANIC ALARM as critical trip point, it will trigger
system reset via SRC module once PANIC IRQ is triggered, it
is pure hardware function, so use it instead of software
reset by cooling device.
Signed-off-by: Anson Huang <b20788@freescale.com>
Tested-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add support to check status of the thermal zone before registering the
zone. This will help on disabling some non-existing thermal zone from
the top level DTS file out of common dtsi thermalzone file.
For example,
we have 3 platforms almost same but thermal zones on this platform are
little bit different. Platform 1 and 2 have three thermal zones and
platform 3 has two thermal zones. To avoid duplication of the thermal
zones entries on each DTS file of platforms,we created one common
dtsi file for thermal zone and included this dtsi file from these
3 platform's top level dts file.
On common thermal zone com dtsi file, all thermal zone are enabled and
need to disable one of thermal zone on platform 3 dts file. For this, we
just added entry status = "disabled" for that thermal zone on platform 3
dts file and along with this change to make it work.
This way, we reuse the common file and control the enable/disable of the
thermal zone from top level dts file.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Create a new event to trace when the temperature is above a trip
point. Use the trace-point when handling non-critical and critical
trip pionts.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Steven Rostedt <rostedt@goodmis.org>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Introduce and use an event to trace when a cooling device's state is
updated. This is useful to follow the effect of governor decisions on
cooling devices.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Steven Rostedt <rostedt@goodmis.org>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Create a new event to trace the temperature of a thermal zone. Using
this event trace the temperature changes of the thermal zone every-time
it is updated.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Steven Rostedt <rostedt@goodmis.org>
Cc: Frederic Weisbecker <fweisbec@gmail.com>
Cc: Ingo Molnar <mingo@redhat.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
This patch add registers, bit fields and compatible strings for Exynos3250 TMU
(Thermal Management Unit). Exynos3250 uses the Cortex-A7 dual cores and has
a target speed of 1.0 GHz.
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
[Add MUX address setting bits by Jonghwa Lee]
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Reviewed-by: Amit Daniel Kachhap<amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
It might not be a problem currently but unregister/uninitialize things
in the reverse order that they are registered/initialized.
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Acked-by: Kyungmin Park <kyungmin.park@samsung.com>
Reviewed-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
DT-enabled Dove has moved from ARCH_DOVE in mach-dove to MACH_DOVE
in mach-mvebu. As non-DT ARCH_DOVE will stay to rot for a while, add a new
DT-only MACH_DOVE to thermal Kconfig.
This was originally supposed to go in via "ARM: dove: prepare new Dove DT Kconfig"
patch from Sebastian Hesselbarth for 3.15, but slipped through the cracks.
I've tested on CuBox that without this patch you can't compile
dove_thermal into a mach-mvebu based kernel, and with this patch I can
build the driver and it works as expected run-time.
v2: non-ascii char creeped in somehow
Signed-off-by: Riku Voipio <riku.voipio@linaro.org>
Cc: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This is the traditional way of obtaining a device driver's register
address space. The aim of this driver is to supply controller specific
information to the ST Thermal Core.
Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Supply controller specific information to the ST Thermal Core.
Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This core is shared by both ST's 'memory mapped' and
'system configuration register' based Thermal controllers.
Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
On latest i.MX6 SOC with thermal calibration data of 0x5A100000,
the critical trip temperature will be an invalid value and
cause system auto shutdown as below log:
thermal thermal_zone0: critical temperature reached(42 C),shutting down
So, with universal formula for thermal sensor, only room
temperature point is calibrated, which means the calibration
data read from fuse only has valid data of bit [31:20], others
are all 0, the critical trip point temperature can NOT depend
on the hot point calibration data, here we set it to 20 C higher
than default passive temperature.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
When binding cooling devices to thermal zones created from the device
tree the minimum and maximum cooling states are in the wrong order
leading to failure to bind.
Fix the order of cooling states in the call to
thermal_zone_bind_cooling_device to fix this.
Cc:Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Reviewed-by: Stephen Boyd <sboyd@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
It looks like this code is missing braces, otherwise the if
statement shouldn't have been indented. Fix it.
Signed-off-by: Stephen Boyd <sboyd@codeaurora.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
On 05/21/2014 04:22 PM, Aaron Lu wrote:
> On 05/21/2014 01:57 PM, Kui Zhang wrote:
>> Hello,
>>
>> I get following error when rmmod thermal.
>>
>> rmmod thermal
>> Killed
While dealing with this problem, I found another problem that also
results in a kernel crash on thermal module removal:
From: Aaron Lu <aaron.lu@intel.com>
Date: Wed, 21 May 2014 16:05:38 +0800
Subject: [PATCH] thermal: hwmon: Make the check for critical temp valid consistent
We used the tz->ops->get_crit_temp && !tz->ops->get_crit_temp(tz, temp)
to decide if we need to create the temp_crit attribute file but we just
check if tz->ops->get_crit_temp exists to decide if we need to remove
that attribute file. Some ACPI thermal zone doesn't have a valid critical
trip point and that would result in removing a non-existent device file
on thermal module unload.
Cc: All applicable <stable@vger.kernel.org>
Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The ACPI object definition can contain passive and critical
trip temperature. Export them via thermal sysfs.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management update from Zhang Rui:
"Specifics:
- fix a bug in Exynos thermal driver, which overwrites the hardware
trip point threshold when updating software trigger levels and
results in emergency shutdown. From: Tushar Behera.
- add thermal sensor support for Armada 375 and 38x SoCs. From
Ezequiel Garcia.
- add TMU (Thermal Management Unit) support for Exynos5260 and
Exynos5420 SoCs. From Naveen Krishna Chatradhi.
- add support for the additional digital temperature sensors in the
Intel SoCs like Bay Trail. From: Srinivas Pandruvada.
- a couple of cleanups and small fixes from Jingoo Han, Bartlomiej
Zolnierkiewicz, Geert Uytterhoeven, Jacob Pan, Paul Walmsley and
Lan,Tianyu"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (21 commits)
thermal: spear: remove unnecessary OOM messages
thermal: exynos: remove unnecessary OOM messages
thermal: rcar: remove unnecessary OOM messages
thermal: armada: Support Armada 380 SoC
thermal: armada: Support Armada 375 SoC
thermal: armada: Allow to specify an 'inverted readout' sensor
thermal: armada: Pass the platform_device to init_sensor()
thermal: armada: Add generic infrastructure to handle the sensor
thermal: armada: Add infrastructure to support generic formulas
thermal: armada: Rename armada_thermal_ops struct
thermal/intel_powerclamp: add newer cpu ids
thermal: rcar: Use pm_runtime_put() i.s.o. pm_runtime_put_sync()
thermal: samsung: Only update available threshold limits
Thermal/int3403: Fix thermal hysteresis unit conversion
thermal: Intel SoC DTS thermal
thermal: samsung: Add TMU support for Exynos5260 SoCs
thermal: samsung: Add TMU support for Exynos5420 SoCs
thermal: samsung: change base_common to more meaningful base_second
thermal: samsung: replace inten_ bit fields with intclr_
thermal: offer Samsung thermal support only when ARCH_EXYNOS is defined
...
The site-specific OOM messages are unnecessary, because they
duplicate the MM subsystem generic OOM message.
Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The site-specific OOM messages are unnecessary, because they
duplicate the MM subsystem generic OOM message.
Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The site-specific OOM messages are unnecessary, because they
duplicate the MM subsystem generic OOM message.
Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Acked-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Now that a generic infrastructure is in place, it's possible to support
the Armada 380 SoC thermal sensor. This sensor is similar to the one
available in the already supported SoCs, with its specific temperature formula
and specific sensor initialization.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Now that a generic infrastructure is in place, it's possible to support
the new Armada 375 SoC thermal sensor. This sensor is similar to the one
available in the already supported SoCs, with its specific temperature formula
and specific sensor initialization.
In addition, we also add support for the Z1 SoC stepping, which needs
an initialization-quirk to work properly.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In order to support inverted-formula thermal sensor readout, this commit
introduces an 'inverted' field in the SoC-specific structure which
allows to specify an inversion of the temperature formula.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In order to perform SoC-specific quirks on platforms that need them,
this commit adds a new parameter to the init_sensor() function.
This will be used to support early silicons of the Armada 375 SoC,
to workaround some hardware issues.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In order to support similar SoC where the sensor value and valid
bit can have different shifts and/or mask, we add such fields to the
per-variant structure, instead of having the values hardcoded.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In order to support other similar SoC, with different sensor
coefficients, this commit adds the coeficients to the per-variant
structure, instead of having the formula hardcoded.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
As preparation work to add a generic infrastructure to support
different SoC variants, the armada_thermal_ops will be used
to host the SoC-specific fields, such as formula values and
register shifts.
For this reason, the name armada_thermal_ops is no longer suitable,
and this commit replaces it with armada_thermal_data.
Acked-by: Jason Cooper <jason@lakedaemon.net>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
