This function call was found to be unnecessary as there is no equivalent
platform_get_drvdata() call to access the private data of the driver. Also,
the private data is defined in this driver, so there is no risk of it being
accessed outside of this driver file.
Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com>
Reviewed-by: Alexandru Ardelean <alex@shruggie.ro>
Reviewed-by: Florian Fainelli <florian.fainelli@broadcom.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230809154813.16033-1-aboutphysycs@gmail.com
The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.
The debug message is already displayed from the call site of this
ops. So we can remove it.
On the other side, the error should not be displayed because in
production that can raise tons of messages.
Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.
Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.
Remove those messages.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/202301181631362083446@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Tested-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20220804224349.1926752-11-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Utilize platform_get_irq_optional() to silence these messages:
brcmstb_thermal a581500.thermal: IRQ index 0 not found
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20220301181412.2008044-1-f.fainelli@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Since we do not have interrupts on BCM7216, we cannot have trip point
crossing, the thermal subsystem expects us to provide a NULL set_trips
operation in that case, so make it possible to provide per-process
thermal_zone_of_device_ops
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-7-f.fainelli@gmail.com
If we are successful grabbing the interrupt resource, then register an
interrupt handler, this makes it easier to support the interrupt as
being optional, which is it for 7216.
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-6-f.fainelli@gmail.com
Match the 7216 compatible string in order to derive the correct 16nm
process thermal parameters to obtain correct readings.
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-5-f.fainelli@gmail.com
The driver is currently assuming that it is operating with a 28nm
process chip, which has a specific formula to convert temperature to a
code and vice versa. Update the code to support providing two key
values: offset and multiplier to derive the correct formulas.
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-3-f.fainelli@gmail.com
At the time the brcmstb_thermal driver and its binding were merged, the
DT binding did not make the coefficients properties a mandatory one,
therefore all users of the brcmstb_thermal driver out there have a non
functional implementation with zero coefficients. Even if these
properties were provided, the formula used for computation is incorrect.
The coefficients are entirely process specific (right now, only 28nm is
supported) and not board or SoC specific, it is therefore appropriate to
hard code them in the driver given the compatibility string we are
probed with which has to be updated whenever a new process is
introduced.
We remove the existing coefficients definition since subsequent patches
are going to add support for a new process and will introduce new
coefficients as well.
Fixes: 9e03cf1b2d ("thermal: add brcmstb AVS TMON driver")
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-2-f.fainelli@gmail.com
Based on 1 normalized pattern(s):
this software is licensed under the terms of the gnu general public
license version 2 as published by the free software foundation and
may be copied distributed and modified under those terms this
program is distributed in the hope that it will be useful but
without any warranty without even the implied warranty of
merchantability or fitness for a particular purpose see the gnu
general public license for more details
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 285 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190529141900.642774971@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Pull thermal SoC updates from Eduardo Valentin:
- Tegra DT binding documentation for Tegra194
- Armada now supports ap806 and cp110
- RCAR thermal now supports R8A774C0 and R8A77990
- Fixes on thermal_hwmon, IMX, generic-ADC, ST, RCAR, Broadcom,
Uniphier, QCOM, Tegra, PowerClamp, and Armada thermal drivers.
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (22 commits)
thermal: generic-adc: Fix adc to temp interpolation
thermal: rcar_thermal: add R8A77990 support
dt-bindings: thermal: rcar-thermal: add R8A77990 support
thermal: rcar_thermal: add R8A774C0 support
dt-bindings: thermal: rcar-thermal: add R8A774C0 support
dt-bindings: cp110: document the thermal interrupt capabilities
dt-bindings: ap806: document the thermal interrupt capabilities
MAINTAINERS: thermal: add entry for Marvell MVEBU thermal driver
thermal: armada: add overheat interrupt support
thermal: st: fix Makefile typo
thermal: uniphier: Convert to SPDX identifier
thermal/intel_powerclamp: Change to use DEFINE_SHOW_ATTRIBUTE macro
thermal: tegra: soctherm: Change to use DEFINE_SHOW_ATTRIBUTE macro
dt-bindings: thermal: tegra-bpmp: Add Tegra194 support
thermal: imx: save one condition block for normal case of nvmem initialization
thermal: imx: fix for dependency on cpu-freq
thermal: tsens: qcom: do not create duplicate regmap debugfs entries
thermal: armada: Use PTR_ERR_OR_ZERO in armada_thermal_probe_legacy()
dt-bindings: thermal: rcar-gen3-thermal: All variants use 3 interrupts
thermal: broadcom: use devm_thermal_zone_of_sensor_register
...
Using devm_thermal_zone_of_sensor_register allows to simplify some
error handling code, drop a label, and drop the remove function.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The thermal_zone_of_device_ops structure can be const as it is only
passed as the last argument of thermal_zone_of_sensor_register
and the corresponding parameter is declared as const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The AVS TMON core provides temperature readings, a pair of configurable
high- and low-temperature threshold interrupts, and an emergency
over-temperature chip reset. The driver utilizes the first two to
provide temperature readings and high-temperature notifications to
applications. The over-temperature reset is not exposed to
applications; this reset threshold is critical to the system and should
be set with care within the bootloader.
Applications may choose to utilize the notification mechanism, the
temperature reading mechanism (e.g., through polling), or both.
Signed-off-by: Brian Norris <computersforpeace@gmail.com>
Signed-off-by: Doug Berger <opendmb@gmail.com>
Signed-off-by: Markus Mayer <mmayer@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
