The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.
To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().
Trivially convert this driver from always returning zero in the remove
callback to the void returning variant.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
This function call was found to be unnecessary as there is no equivalent
platform_get_drvdata() call to access the private data of the driver. Also,
the private data is defined in this driver, so there is no risk of it being
accessed outside of this driver file.
Signed-off-by: Andrei Coardos <aboutphysycs@gmail.com>
Reviewed-by: Alexandru Ardelean <alex@shruggie.ro>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230810112015.3578-1-aboutphysycs@gmail.com
The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Some of TI's J721E SoCs require a software trimming procedure for the
temperature monitors to function properly. To determine if a particular
J721E is not affected by this erratum, both bits in the WKUP_SPARE_FUSE0
region must be set. Other SoCs, not affected by this erratum, will not
need this region.
Map the 'fuse_base' region only when the erratum fix is needed.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-5-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
'fuse_base' is only needed during the initial probe function to provide
data for a software trimming method for some of TI's devices affected by
the i2128 erratum. The devices not affected will not use this region
Remove fuse_base from the main k3_j72xx_bandgap structure
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-4-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Some of TI's J721E SoCs require a software trimming method to report
temperatures accurately. Currently we are using a few different data
types to indicate when we should apply the erratum.
Change the 'workaround_needed' variable's data type to a bool to align
with how we are using this variable currently.
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-3-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The k3_thermal_get_temp() function can be simplified to return only
the result of k3_bgp_read_temp() without needing the 'ret' variable
Signed-off-by: Bryan Brattlof <bb@ti.com>
Link: https://lore.kernel.org/r/20221031232702.10339-2-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-22-daniel.lezcano@linexp.org
Reviewed-by: Bryan Brattlof <bb@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Fix sparse warnings:
drivers/thermal/k3_j72xx_bandgap.c:532:36: sparse: sparse: symbol 'k3_j72xx_bandgap_j721e_data' was not declared. Should it be static?
drivers/thermal/k3_j72xx_bandgap.c:536:36: sparse: sparse: symbol 'k3_j72xx_bandgap_j7200_data' was not declared. Should it be static?
Reported-by: Hulk Robot <hulkci@huawei.com>
Signed-off-by: Jin Xiaoyun <jinxiaoyun2@huawei.com>
Link: https://lore.kernel.org/r/20220613063111.654893-1-jinxiaoyun2@huawei.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
This while loop exits with "i" set to -1 and so then it sets:
derived_table[-1] = derived_table[0] - 300;
There is no need for this assignment at all. Just delete it.
Fixes: 72b3fc61c752 ("thermal: k3_j72xx_bandgap: Add the bandgap driver support")
Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Link: https://lore.kernel.org/r/YoetjwcOEzYEFp9b@kili
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
If an error occurs in the k3_j72xx_bandgap_probe() function the memory
allocated to the 'ref_table' will not be released.
Add a err_free_ref_table step to the error path to free 'ref_table'
Fixes: 72b3fc61c752 ("thermal: k3_j72xx_bandgap: Add the bandgap driver support")
Reported-by: kernel test robot <lkp@intel.com>
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Bryan Brattlof <bb@ti.com>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20220525213617.30002-1-bb@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Add VTM thermal support. In the Voltage Thermal Management
Module(VTM), K3 J72XX supplies a voltage reference and a temperature
sensor feature that are gathered in the band gap voltage and
temperature sensor (VBGAPTS) module. The band gap provides current and
voltage reference for its internal circuits and other analog IP
blocks. The analog-to-digital converter (ADC) produces an output value
that is proportional to the silicon temperature.
Currently reading temperatures only is supported. There are no
active/passive cooling agent supported.
J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455
The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production,
with the resulting values stored in software-readable registers. Software
should use these register values when translating the Temperature
Monitor output codes to temperature values.
It has an involved workaround. Software needs to read the error codes for
-40C, 30C, 125C from the efuse for each device & derive a new look up table
for adc to temperature conversion. Involved calculating slopes & constants
using 3 different straight line equations with adc refernce codes as the
y-axis & error codes in the x-axis.
-40C to 30C
30C to 125C
125C to 150C
With the above 2 line equations we derive the full look-up table to
workaround the errata i2128 for j721e SoC.
Tested temperature reading on J721e SoC & J7200 SoC.
[daniel.lezcano@linaro.org: Generate look-up tables run-time]
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Uwe Kleine-König