Fix up inconsistent usage of upper and lowercase letters in "Samsung"
and "Exynos" names.
"SAMSUNG" and "EXYNOS" are not abbreviations but regular trademarked
names. Therefore they should be written with lowercase letters starting
with capital letter.
The lowercase "Exynos" name is promoted by its manufacturer Samsung
Electronics Co., Ltd., in advertisement materials and on website.
Although advertisement materials usually use uppercase "SAMSUNG", the
lowercase version is used in all legal aspects (e.g. on Wikipedia and in
privacy/legal statements on
https://www.samsung.com/semiconductor/privacy-global/).
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200104152107.11407-7-krzk@kernel.org
Add SPDX license identifiers to all Make/Kconfig files which:
- Have no license information of any form
These files fall under the project license, GPL v2 only. The resulting SPDX
license identifier is:
GPL-2.0-only
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:
drivers/built-in.o: In function `kirkwood_thermal_probe':
kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource'
drivers/built-in.o: In function `exynos_tmu_probe':
exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap'
The users of devm_ioremap_resource() which are compile-testable should
depend on HAS_IOMEM.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
The exynos thermal driver use the of_thermal_*() API to parse the basic data
for thermal management from devicetree file. So, if CONFIG_EXYNOS_THERMAL is
selected without CONFIG_THERMAL_OF, kernel can build it without any problem.
But, exynos thermal driver is not working with following error log. This patch
add the dependency of CONFIG_THERMAL_OF instead of CONFIG_OF.
[ 1.458644] get_th_reg: Cannot get trip points from of-thermal.c!
[ 1.459096] get_th_reg: Cannot get trip points from of-thermal.c!
[ 1.465211] exynos4412_tmu_initialize: No CRITICAL trip point defined at of-thermal.c!
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
After removing exynos_thermal_common.[c|h] files the CONFIG_EXYNOS_THERMA_CORE
is not needed anymore.
This patch removes this entry from Kconfig.
Reported-by: Paul Bolle <pebolle@tiscali.nl>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
As samsung thermal support is enabled only for ARCH_EXYNOS, there is no
need to select ARCH_HAS_BANDGAP from the arch-specific code. Removing this
dependency will also allow the driver to be enabled on 64-bit SoCs.
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Acked-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Abhilash Kesavan <a.kesavan@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Commit 1cd1ecb6 ("thermal: exynos: Remove non DT based support")
cleaned up some non-DT code. However, there were few more things
needed for complete cleanup to make this driver DT only.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code splits the exynos tmu driver code into SOC specific data parts.
This will simplify adding new SOC specific data to the same TMU controller.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code bifurcates exynos thermal implementation into common and sensor
specific parts. The common thermal code interacts with core thermal layer and
core cpufreq cooling parts and is independent of SOC specific driver. This
change is needed to cleanly add support for new TMU sensors.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch removes the dependency on CPU_THERMAL for compiling TMU driver.
This is useful for cases when only TMU controller needs to be initialised
without cpu cooling action.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch uses the recently added config sybmol ARCH_HAS_BANDGAP to enable
the TMU driver. This will allow adding support for new soc easily as now it
is the platform responsibility to enable this config symbol for a particular
soc.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
