Commit graph

19 commits

Author SHA1 Message Date
Rob Herring
f6a756e8fb thermal: Explicitly include correct DT includes
The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.

Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-07-31 20:03:42 +02:00
Yangtao Li
b0526e02c6 thermal/drivers/imx: Remove redundant msg in imx8mm_tmu_probe() and imx_sc_thermal_probe()
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly
print error information.

Signed-off-by: Yangtao Li <frank.li@vivo.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230620090732.50025-4-frank.li@vivo.com
2023-06-26 12:03:14 +02:00
Daniel Lezcano
4a16c190f7 thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()
The devres variant of thermal_add_hwmon_sysfs() only takes the thermal
zone structure pointer as parameter.

Actually, it uses the tz->device to add it in the devres list.

It is preferable to use the device registering the thermal zone
instead of the thermal zone device itself. That prevents the driver
accessing the thermal zone structure internals and it is from my POV
more correct regarding how devm_ is used.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> #amlogic_thermal
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano
abda7383ec thermal: Remove debug or error messages in get_temp() ops
Some get_temp() ops implementation are showing an error or a debug
message if the reading of the sensor fails.

The debug message is already displayed from the call site of this
ops. So we can remove it.

On the other side, the error should not be displayed because in
production that can raise tons of messages.

Finally, some drivers are showing a debug message with the
temperature, this is also accessible through the trace from the core
code in the temperature_update() function.

Another benefit is the dev_* messages are accessing the thermal zone
device field from the structure, so we encapsulate even more the code
by preventing these accesses.

Remove those messages.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> #Armada
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #brcmstb_thermal.c
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano
5f68d0785e thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.

In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.

Use the devdata accessor introduced in the previous patch.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>  #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-03-03 20:45:02 +01:00
Daniel Lezcano
9272d2d43b thermal: Remove core header inclusion from drivers
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.

Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.

Remove this inclusion in every place where it is possible.

Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.

The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.

The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.

No functional changes intended.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-02-15 17:29:48 +01:00
Viorel Suman
1cea99593c thermal/drivers/imx_sc_thermal: Add iMX8QM sensors
Add iMX8QM sensors. As stated in 31fd4b9db1 ("thermal/drivers/imx_sc:
Rely on the platform data to get the resource id"):

    The thermal OF code returns -ENODEV if the thermal zone registration
    with a specific id fails because the description is not available in
    the DT for such a sensor id. In this case we continue with the other
    ids without bailing out with an error.

Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Dong Aisheng <aisheng.dong@nxp.com>
Link: https://lore.kernel.org/r/20230117091956.61729-2-viorel.suman@oss.nxp.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-17 10:28:13 +01:00
Viorel Suman
4b26b7c9cd thermal/drivers/imx_sc_thermal: Fix the loop condition
The minimal resource ID is 0: IMX_SC_R_AP_0=0, so fix
the loop condition. Aside of this - constify the array.

Fixes: 31fd4b9db1 ("thermal/drivers/imx_sc: Rely on the platform data to get the resource id")
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Dong Aisheng <Aisheng.dong@nxp.com>
Link: https://lore.kernel.org/r/20230117091956.61729-1-viorel.suman@oss.nxp.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-01-17 10:28:07 +01:00
Uwe Kleine-König
5011a11029 thermal/drivers/imx_sc_thermal: Drop empty platform remove function
A remove callback just returning 0 is equivalent to no remove callback
at all. So drop the useless function.

Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Link: https://lore.kernel.org/r/20221212220217.3777176-1-u.kleine-koenig@pengutronix.de
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14 15:27:30 +01:00
Daniel Lezcano
31fd4b9db1 thermal/drivers/imx_sc: Rely on the platform data to get the resource id
Currently the imx_sc driver is reimplementing part of the thermal zone
parsing from the thermal OF tree code to get the sensor id associated
with a thermal zone sensor.

The driver platform specific code should know what sensor is present
and not rely on the thermal zone description to do a discovery. Well
that is arguable but all the other drivers have a per platform data
telling what sensor id to use.

The imx_sc thermal driver is the only one using a different
approach. Not invalid but forcing to keep a specific function
'thermal_zone_of_get_sensor_id()' to get the sensor id for a specific
thermal zone as the self-explanatory function tells and having device
tree code inside the driver.

The thermal OF code had a rework and remains now self-encapsulated
with a register/unregister functions and their 'devm' variants, except
for the function mentioned above.

After investigating, it appears the imx_sc sensor is defined in
arch/arm64/boot/dts/freescale/imx8qxp.dtsi:

which defines the cpu-thermal zone with the id: IMX_SC_R_SYSTEM

This dtsi is included by:
 - imx8qxp-ai_ml.dts
 - imx8qxp-colibri.dtsi
 - imx8qxp-mek.dts

The two first ones do not define more thermal zones
The third one adds the pmic-thermal0 zone with id: IMX_SC_R_PMIC_0

The thermal OF code returns -ENODEV if the thermal zone registration
with a specific id fails because the description is not available in
the DT for such a sensor id. In this case we continue with the other
ids without bailing out with an error.

So we can build for the 'fsl,imx-sc-thermal' a compatible data, an
array of sensor ids containing IMX_SC_R_SYSTEM and IMX_SC_R_PMIC_0.

The latter won't be found but that will not result in an error but a
normal case where we continue the initialization with other ids.

Just to clarify, it is what the thermal framework does and what the
other drivers are expecting: when a registration fails with -ENODEV
this is not an error but a case where the description is not found in
the device tree, that be can the entire thermal zones description or a
specific thermal zone with an unknown id.

There is one small functional change but without impact. When there is
no 'thermal-zones' description the probe function was returning
'-ENODEV', now it returns zero. When a thermal zone fails to register
with an error different from '-ENODEV', the error is detected and
returned.

Change the code accordingly and remove the OF code from the driver.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220818082316.2717095-1-daniel.lezcano@linaro.org
2022-10-04 11:20:59 +02:00
Daniel Lezcano
32fb9a8a9d thermal/drivers/imx: Switch to new of API
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.

Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.

Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-17-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-08-17 14:09:38 +02:00
Miaoqian Lin
09700c504d thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe
of_find_node_by_name() returns a node pointer with refcount
incremented, we should use of_node_put() on it when done.
Add missing of_node_put() to avoid refcount leak.

Fixes: e20db70dba ("thermal: imx_sc: add i.MX system controller thermal support")
Signed-off-by: Miaoqian Lin <linmq006@gmail.com>
Link: https://lore.kernel.org/r/20220517055121.18092-1-linmq006@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19 12:11:53 +02:00
Krzysztof Kozlowski
3da97620e8 thermal/drivers/imx_sc: Add missing of_node_put for loop iteration
Early exits from for_each_available_child_of_node() should decrement the
node reference counter.  Reported by Coccinelle:

  drivers/thermal/imx_sc_thermal.c:93:1-33: WARNING:
    Function "for_each_available_child_of_node" should have of_node_put() before return around line 97.

Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210614192230.19248-1-krzysztof.kozlowski@canonical.com
2021-06-14 22:41:00 +02:00
Linus Torvalds
df2fbf5bfa - Add the hwmon support on the i.MX SC (Anson Huang)
- Thermal framework cleanups (self-encapsulation, pointless stubs,
   private structures) (Daniel Lezcano)
 
 - Use the PM QoS frequency changes for the devfreq cooling device (Matthias
   Kaehlcke)
 
 - Remove duplicate error messages from platform_get_irq() error handling
   (Markus Elfring)
 
 - Add support for the bandgap sensors (Keerthy)
 
 - Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)
 
 - Add Renesas R-Car maintainer entry (Niklas Söderlund)
 
 - Fix error checking after calling ti_bandgap_get_sensor_data() for the TI SoC
   thermal (Sudip Mukherjee)
 
 - Add latency constraint for the idle injection, the DT binding and the change
   the registering function (Daniel Lezcano)
 
 - Convert the thermal framework binding to the Yaml schema (Amit Kucheria)
 
 - Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A. R. Silva)
 
 - Thermal framework cleanups (alphabetic order for heads, replace module.h by
   export.h, make file naming consistent) (Amit Kucheria)
 
 - Merge tsens-common into the tsens driver (Amit Kucheria)
 
 - Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)
 
 - Clean up the rcar_thermal_update_temp() function in the rcar thermal driver
   (Niklas Söderlund)
 
 - Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian Tang)
 
 - Export GDDV, OEM vendor variables, and don't require IDSP for the int340x
   thermal driver - trivial conflicts fixed (Matthew Garrett)
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Merge tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux

Pull thermal updates from Daniel Lezcano:

 - Add the hwmon support on the i.MX SC (Anson Huang)

 - Thermal framework cleanups (self-encapsulation, pointless stubs,
   private structures) (Daniel Lezcano)

 - Use the PM QoS frequency changes for the devfreq cooling device
   (Matthias Kaehlcke)

 - Remove duplicate error messages from platform_get_irq() error
   handling (Markus Elfring)

 - Add support for the bandgap sensors (Keerthy)

 - Statically initialize .get_mode/.set_mode ops (Andrzej Pietrasiewicz)

 - Add Renesas R-Car maintainer entry (Niklas Söderlund)

 - Fix error checking after calling ti_bandgap_get_sensor_data() for the
   TI SoC thermal (Sudip Mukherjee)

 - Add latency constraint for the idle injection, the DT binding and the
   change the registering function (Daniel Lezcano)

 - Convert the thermal framework binding to the Yaml schema (Amit
   Kucheria)

 - Replace zero-length array with flexible-array on i.MX 8MM (Gustavo A.
   R. Silva)

 - Thermal framework cleanups (alphabetic order for heads, replace
   module.h by export.h, make file naming consistent) (Amit Kucheria)

 - Merge tsens-common into the tsens driver (Amit Kucheria)

 - Fix platform dependency for the Qoriq driver (Geert Uytterhoeven)

 - Clean up the rcar_thermal_update_temp() function in the rcar thermal
   driver (Niklas Söderlund)

 - Fix the TMSAR register for the TMUv2 on the Qoriq platform (Yuantian
   Tang)

 - Export GDDV, OEM vendor variables, and don't require IDSP for the
   int340x thermal driver - trivial conflicts fixed (Matthew Garrett)

* tag 'thermal-v5.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (48 commits)
  thermal/int340x_thermal: Don't require IDSP to exist
  thermal/int340x_thermal: Export OEM vendor variables
  thermal/int340x_thermal: Export GDDV
  thermal: qoriq: Update the settings for TMUv2
  thermal: rcar_thermal: Clean up rcar_thermal_update_temp()
  thermal: qoriq: Add platform dependencies
  drivers: thermal: tsens: Merge tsens-common.c into tsens.c
  thermal/of: Rename of-thermal.c
  thermal/governors: Prefix all source files with gov_
  thermal/drivers/user_space: Sort headers alphabetically
  thermal/drivers/of-thermal: Sort headers alphabetically
  thermal/drivers/cpufreq_cooling: Replace module.h with export.h
  thermal/drivers/cpufreq_cooling: Sort headers alphabetically
  thermal/drivers/clock_cooling: Include export.h
  thermal/drivers/clock_cooling: Sort headers alphabetically
  thermal/drivers/thermal_hwmon: Include export.h
  thermal/drivers/thermal_hwmon: Sort headers alphabetically
  thermal/drivers/thermal_helpers: Include export.h
  thermal/drivers/thermal_helpers: Sort headers alphabetically
  thermal/core: Replace module.h with export.h
  ...
2020-06-12 14:10:21 -07:00
Dong Aisheng
755a739794 dt-bindings: firmware: imx: Move system control into dt-binding headfile
i.MX8 SoCs DTS file needs system control macro definitions, so move them
into dt-binding headfile, then include/linux/firmware/imx/types.h can be
removed and those drivers using it should be changed accordingly.

Signed-off-by: Dong Aisheng <aisheng.dong@nxp.com>
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
2020-05-13 16:19:23 +08:00
Anson Huang
d2bc4dd91d thermal: imx_sc_thermal: Add hwmon support
Expose i.MX SC thermal sensors as HWMON devices.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1585192411-25593-1-git-send-email-Anson.Huang@nxp.com
2020-04-14 11:41:12 +02:00
Anson Huang
968ea0dffa thermal: imx_sc_thermal: Fix incorrect data type
The temperature value passed from SCU could be negative value,
the data type should be signed instead of unsigned.

Fixes: e20db70dba ("thermal: imx_sc: add i.MX system controller thermal support")
Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1584606380-9972-1-git-send-email-Anson.Huang@nxp.com
2020-03-23 15:20:47 +01:00
Anson Huang
1fd213f38b thermal: imx_sc_thermal: Align imx sc thermal msg structs to 4
The i.MX SCU API strongly assumes that messages are composed out
of 4-bytes words but some of our message structs have odd sizeofs,
use __packed __aligned(4) to avoid potential oopses.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1583117485-30922-1-git-send-email-Anson.Huang@nxp.com
2020-03-12 11:56:53 +01:00
Anson Huang
e20db70dba thermal: imx_sc: add i.MX system controller thermal support
i.MX8QXP is an ARMv8 SoC which has a Cortex-M4 system controller
inside, the system controller is in charge of controlling power,
clock and thermal sensors etc..

This patch adds i.MX system controller thermal driver support,
Linux kernel has to communicate with system controller via MU
(message unit) IPC to get each thermal sensor's temperature,
it supports multiple sensors which are passed from device tree,
please see the binding doc for details.

Signed-off-by: Anson Huang <Anson.Huang@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1582330132-13461-3-git-send-email-Anson.Huang@nxp.com
2020-03-12 11:40:57 +01:00