Commit graph

149 commits

Author SHA1 Message Date
Hans de Goede
54c5848c21 Thermal: Intel SoC DTS: Translate IO-APIC GSI number to linux irq number
The Intel SoC DTS uses a hardcoded GSI number, before this commit
it was passing it to request_irq as if it were a linux irq number,
but there is no 1:1 mapping so in essence it was requesting a
random interrupt.

Besides this causing the DTS driver to not actually get an interrupt
if the thermal thresholds are exceeded this also is causing an
interrupt conflict on some devices since the linux irq 86 which is
being requested is already in use, leading to oopses like this:

genirq: Flags mismatch irq 86. 00002001 (soc_dts) vs. 00000083 (volume_down)
CPU: 0 PID: 601 Comm: systemd-udevd Tainted: G         C OE     4.17.0-rc6+ #45
Hardware name: Insyde i86/Type2 - Board Product Name, BIOS CHUWI.D86JLBNR03 01/14/2015
Call Trace:
  dump_stack+0x5c/0x80
  __setup_irq.cold.50+0x4e/0xac
  ? request_threaded_irq+0xad/0x160
  request_threaded_irq+0xf5/0x160
  ? 0xffffffffc0a93000
  intel_soc_thermal_init+0x74/0x1000 [intel_soc_dts_thermal]

This commit makes the intel_soc_dts_thermal.c code call
acpi_register_gsi() to translate the hardcoded IO-APIC GSI number (86)
to a linux irq, so that the dts code uses the right interrupt and we
no longer get an oops about an irq conflict.

Signed-off-by: Hans de Goede <hdegoede@redhat.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-07-26 16:02:48 +08:00
Viresh Kumar
8ea229511e thermal: Add cooling device's statistics in sysfs
This extends the sysfs interface for thermal cooling devices and exposes
some pretty useful statistics. These statistics have proven to be quite
useful specially while doing benchmarks related to the task scheduler,
where we want to make sure that nothing has disrupted the test,
specially the cooling device which may have put constraints on the CPUs.
The information exposed here tells us to what extent the CPUs were
constrained by the thermal framework.

The write-only "reset" file is used to reset the statistics.

The read-only "time_in_state_ms" file shows the time (in msec) spent by the
device in the respective cooling states, and it prints one line per
cooling state.

The read-only "total_trans" file shows single positive integer value
showing the total number of cooling state transitions the device has
gone through since the time the cooling device is registered or the time
when statistics were reset last.

The read-only "trans_table" file shows a two dimensional matrix, where
an entry <i,j> (row i, column j) represents the number of transitions
from State_i to State_j.

This is how the directory structure looks like for a single cooling
device:

$ ls -R /sys/class/thermal/cooling_device0/
/sys/class/thermal/cooling_device0/:
cur_state  max_state  power  stats  subsystem  type  uevent

/sys/class/thermal/cooling_device0/power:
autosuspend_delay_ms  runtime_active_time  runtime_suspended_time
control               runtime_status

/sys/class/thermal/cooling_device0/stats:
reset  time_in_state_ms  total_trans  trans_table

This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and
ARM 64-bit Hisilicon hikey960 board running Android.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-04-02 21:49:01 +08:00
Miquel Raynal
a9d58a1aa3 thermal: armada: Update Kconfig and module description
Update Armada thermal driver Kconfig entry as well as the driver's
MODULE_DESCRIPTION content, now that 64-bit SoCs are also supported,
eg. Armada 7K and Armada 8K.

Use the generic term "Marvell EBU Armada SoCs" instead of listing all
the supported SoCs everywhere (excepted in the Kconfig description,
where it is useful to have a list).

Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com>
Reviewed-by: Gregory CLEMENT <gregory.clement@free-electrons.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2018-01-01 13:21:48 -08:00
Zhang Rui
fe9ba5bc73 Merge branch 'imx-nvmem' into thermal-soc 2017-11-02 16:31:52 +08:00
Brian Norris
9e03cf1b2d thermal: add brcmstb AVS TMON driver
The AVS TMON core provides temperature readings, a pair of configurable
high- and low-temperature threshold interrupts, and an emergency
over-temperature chip reset. The driver utilizes the first two to
provide temperature readings and high-temperature notifications to
applications. The over-temperature reset is not exposed to
applications; this reset threshold is critical to the system and should
be set with care within the bootloader.

Applications may choose to utilize the notification mechanism, the
temperature reading mechanism (e.g., through polling), or both.

Signed-off-by: Brian Norris <computersforpeace@gmail.com>
Signed-off-by: Doug Berger <opendmb@gmail.com>
Signed-off-by: Markus Mayer <mmayer@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-10-31 19:32:19 -07:00
Allen Wild
fec3624f0b thermal: enable broadcom menu for arm64 bcm2835
Moving the bcm2835 thermal driver to the broadcom directory prevented it
from getting enabled for arm64 builds, since the broadcom directory is only
available when 32-bit specific ARCH_BCM is set.

Fix this by enabling the Broadcom menu for ARCH_BCM or ARCH_BCM2835.

Fixes: 6892cf07e7 ("thermal: bcm2835: move to the broadcom subdirectory")
Reviewed-by: Eric Anholt <eric@anholt.net>
Signed-off-by: Allen Wild <allenwild93@gmail.com>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-10-31 19:32:13 -07:00
Arnd Bergmann
531fcdeb71 thermal: imx: add NVMEM dependency
The driver now fails to link into vmlinux when CONFIG_NVMEM is a loadable
module:

drivers/thermal/imx_thermal.o: In function `imx_thermal_probe':
imx_thermal.c:(.text+0x360): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x360): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): undefined reference to `nvmem_cell_read_u32'
imx_thermal.c:(.text+0x388): relocation truncated to fit: R_AARCH64_CALL26 against undefined symbol `nvmem_cell_read_u32'

This adds a Kconfig dependency to force it to be a module as well
when its dependency is loadable.

Fixes: 7fe5ba04fcdc ("thermal: imx: Add support for reading OCOTP through nvmem")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Leonard Crestez <leonard.crestez@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-10-18 10:24:13 +08:00
Zhang Rui
b32b5e14b4 Merge branches 'thermal-core', 'thermal-soc', 'thermal-intel' and 'const-thermal-zone-structure' into next 2017-09-08 11:20:04 +08:00
Kunihiko Hayashi
86da439175 thermal: uniphier: add UniPhier thermal driver
Add a thermal driver for on-chip PVT (Process, Voltage and Temperature)
monitoring unit implemented on UniPhier SoCs. This driver supports
temperature monitoring and alert function.

Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-11 10:49:52 +08:00
Arnd Bergmann
68fd77cf8a thermal: fix INTEL_SOC_DTS_IOSF_CORE dependencies
We get a Kconfig warning when selecting this without also enabling
CONFIG_PCI:

warning: (X86_INTEL_LPSS && INTEL_SOC_DTS_IOSF_CORE
&& SND_SST_IPC_ACPI && MMC_SDHCI_ACPI && PUNIT_ATOM_DEBUG)
selects IOSF_MBI which has unmet direct dependencies (PCI)

This adds a new depedency.

Fixes: 3a2419f865 ("Thermal: Intel SoC: DTS thermal use common APIs")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-08-08 17:14:26 +08:00
Linus Torvalds
6a776e47a0 Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:

 - Fix a problem where orderly_shutdown() is called for multiple times
   due to multiple critical overheating events raised in a short period
   by platform thermal driver. (Keerthy)

 - Introduce a backup thermal shutdown mechanism, which invokes
   kernel_power_off()/emergency_restart() directly, after
   orderly_shutdown() being issued for certain amount of time(specified
   via Kconfig). This is useful in certain conditions that userspace may
   be unable to power off the system in a clean manner and leaves the
   system in a critical state, like in the middle of driver probing
   phase. (Keerthy)

 - Introduce a new interface in thermal devfreq_cooling code so that the
   driver can provide more precise data regarding actual power to the
   thermal governor every time the power budget is calculated. (Lukasz
   Luba)

 - Introduce BCM 2835 soc thermal driver and northstar thermal driver,
   within a new sub-folder. (Rafał Miłecki)

 - Introduce DA9062/61 thermal driver. (Steve Twiss)

 - Remove non-DT booting on TI-SoC driver. Also add support to fetching
   coefficients from DT. (Keerthy)

 - Refactorf RCAR Gen3 thermal driver. (Niklas Söderlund)

 - Small fix on MTK and intel-soc-dts thermal driver. (Dawei Chien,
   Brian Bian)

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
  thermal: core: Add a back up thermal shutdown mechanism
  thermal: core: Allow orderly_poweroff to be called only once
  Thermal: Intel SoC DTS: Change interrupt request behavior
  trace: thermal: add another parameter 'power' to the tracing function
  thermal: devfreq_cooling: add new interface for direct power read
  thermal: devfreq_cooling: refactor code and add get_voltage function
  thermal: mt8173: minor mtk_thermal.c cleanups
  thermal: bcm2835: move to the broadcom subdirectory
  thermal: broadcom: ns: specify myself as MODULE_AUTHOR
  thermal: da9062/61: Thermal junction temperature monitoring driver
  Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding
  thermal: broadcom: add Northstar thermal driver
  dt-bindings: thermal: add support for Broadcom's Northstar thermal
  thermal: bcm2835: add thermal driver for bcm2835 SoC
  dt-bindings: Add thermal zone to bcm2835-thermal example
  thermal: rcar_gen3_thermal: add suspend and resume support
  thermal: rcar_gen3_thermal: store device match data in private structure
  thermal: rcar_gen3_thermal: enable hardware interrupts for trip points
  thermal: rcar_gen3_thermal: record and check number of TSCs found
  thermal: rcar_gen3_thermal: check that TSC exists before memory allocation
  ...
2017-05-12 11:58:45 -07:00
Zhang Rui
cb15c81a0c Merge branch 'thermal-soc' into next 2017-05-06 19:31:19 +08:00
Keerthy
ef1d87e06a thermal: core: Add a back up thermal shutdown mechanism
orderly_poweroff is triggered when a graceful shutdown
of system is desired. This may be used in many critical states of the
kernel such as when subsystems detects conditions such as critical
temperature conditions. However, in certain conditions in system
boot up sequences like those in the middle of driver probes being
initiated, userspace will be unable to power off the system in a clean
manner and leaves the system in a critical state. In cases like these,
the /sbin/poweroff will return success (having forked off to attempt
powering off the system. However, the system overall will fail to
completely poweroff (since other modules will be probed) and the system
is still functional with no userspace (since that would have shut itself
off).

However, there is no clean way of detecting such failure of userspace
powering off the system. In such scenarios, it is necessary for a backup
workqueue to be able to force a shutdown of the system when orderly
shutdown is not successful after a configurable time period.

Reported-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2017-05-05 16:01:45 +08:00
Linus Torvalds
d26f552ebb - New Drivers
- Freescale MXS Low Resolution ADC
    - Freescale i.MX23/i.MX28 LRADC touchscreen
    - Motorola CPCAP Power Button
    - TI LMU (Lighting Management Unit)
    - Atmel SMC (Static Memory Controller)
 
  - New Device Support
    - Add support for X-Powers AXP803 to axp20x
    - Add support for Dialog Semi DA9061 to da9062-core
    - Add support for Intel Cougar Mountain to lpc_ich
    - Add support for Intel Gemini Lake to lpc_ich
 
  - New Functionality
    - Add Device Tree support; wm831x-*, axp20x, ti-lmu, da9062, sun4i-gpadc
    - Add IRQ sense support; motorola-cpcap
    - Add ACPI support; cros_ec
    - Add Reset support; altera-a10sr
    - Add ADC support; axp20x
    - Add AC Power support; axp20x
    - Add Runtime PM support; atmel-ebi, exynos-lpass
    - Add Battery Power Supply support; axp20x
    - Add Clock support; exynos-lpass, hi655x-pmic
 
  - Fix-ups
    - Implicitly specify required headers; motorola-cpcap, intel_soc_pmic_bxtwc
    - Add .remove() method; stm32-timers, exynos-lpass
    - Remove unused code; intel_soc_pmic_core, intel-lpss-acpi, ipaq-micro, atmel-smc, menelaus
    - Rename variables for clarity; axp20x
    - Convert pr_warning() to pr_warn(); db8500-prcmu, sta2x11-mfd, twl4030-power
    - Improve formatting; arizona-core, axp20x
    - Use raw_spinlock_*() variants; asic3, t7l66xb, tc6393xb
    - Simplify/refactor code; arizona-core, atmel-ebi
    - Improve error checking; intel_soc_pmic_core
 
  - Bug Fixes
    - Ensure OMAP3630/3730 boards can successfully reboot; twl4030-power
    - Correct max-register value; stm32-timers
    - Extend timeout to account for clock stretching; cros_ec_spi
    - Use correct IRQ trigger type; motorola-cpcap
    - Fix bad use of IRQ sense register; motorola-cpcap
    - Logic error "||" should be "&&"; mxs-lradc-ts
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Merge tag 'mfd-next-4.12' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd

Pull MFD updates from Lee Jones:
 "New Drivers:
   - Freescale MXS Low Resolution ADC
   - Freescale i.MX23/i.MX28 LRADC touchscreen
   - Motorola CPCAP Power Button
   - TI LMU (Lighting Management Unit)
   - Atmel SMC (Static Memory Controller)

  New Device Support:
   - Add support for X-Powers AXP803 to axp20x
   - Add support for Dialog Semi DA9061 to da9062-core
   - Add support for Intel Cougar Mountain to lpc_ich
   - Add support for Intel Gemini Lake to lpc_ich

  New Functionality:
   - Add Device Tree support; wm831x-*, axp20x, ti-lmu, da9062, sun4i-gpadc
   - Add IRQ sense support; motorola-cpcap
   - Add ACPI support; cros_ec
   - Add Reset support; altera-a10sr
   - Add ADC support; axp20x
   - Add AC Power support; axp20x
   - Add Runtime PM support; atmel-ebi, exynos-lpass
   - Add Battery Power Supply support; axp20x
   - Add Clock support; exynos-lpass, hi655x-pmic

  Fix-ups:
   - Implicitly specify required headers; motorola-cpcap, intel_soc_pmic_bxtwc
   - Add .remove() method; stm32-timers, exynos-lpass
   - Remove unused code; intel_soc_pmic_core, intel-lpss-acpi, ipaq-micro, atmel-smc, menelaus
   - Rename variables for clarity; axp20x
   - Convert pr_warning() to pr_warn(); db8500-prcmu, sta2x11-mfd, twl4030-power
   - Improve formatting; arizona-core, axp20x
   - Use raw_spinlock_*() variants; asic3, t7l66xb, tc6393xb
   - Simplify/refactor code; arizona-core, atmel-ebi
   - Improve error checking; intel_soc_pmic_core

  Bug Fixes:
   - Ensure OMAP3630/3730 boards can successfully reboot; twl4030-power
   - Correct max-register value; stm32-timers
   - Extend timeout to account for clock stretching; cros_ec_spi
   - Use correct IRQ trigger type; motorola-cpcap
   - Fix bad use of IRQ sense register; motorola-cpcap
   - Logic error "||" should be "&&"; mxs-lradc-ts"

* tag 'mfd-next-4.12' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (79 commits)
  input: touchscreen: mxs-lradc: || vs && typos
  dt-bindings: Add AXP803's regulator info
  mfd: axp20x: Support AXP803 variant
  dt-bindings: Add device tree binding for X-Powers AXP803 PMIC
  dt-bindings: Make AXP20X compatible strings one per line
  mfd: intel_soc_pmic_core: Fix unchecked return value
  mfd: menelaus: Remove obsolete local_irq_disable() and local_irq_enable()
  mfd: omap-usb-tll: Configure ULPIAUTOIDLE
  mfd: omap-usb-tll: Fix inverted bit use for USB TLL mode
  mfd: palmas: Fixed spelling mistake in error message
  mfd: lpc_ich: Add support for Intel Gemini Lake SoC
  mfd: hi655x: Add the clock cell to provide WiFi and Bluetooth
  mfd: intel_soc_pmic: Fix a mess with compilation units
  mfd: exynos-lpass: Add runtime PM support
  mfd: exynos-lpass: Add missing remove() function
  mfd: exynos-lpass: Add support for clocks
  mfd: exynos-lpass: Remove pad retention control
  iio: adc: add support for X-Powers AXP20X and AXP22X PMICs ADCs
  mfd: cpcap: Fix bad use of IRQ sense register
  mfd: cpcap: Use ack_invert interrupts
  ...
2017-05-03 12:16:25 -07:00
Andy Shevchenko
b5238b4185 mfd: intel_soc_pmic: Fix a mess with compilation units
Crystal Cove and Whiskey Cove are two different PMICs which are
installed on Intel Atom SoC based platforms.

Moreover there are two independent drivers that by some reason were
supposed (*) to get into one kernel module.

Fix the mess by clarifying Kconfig option for Crystal Cove and split
Whiskey Cove out of it.

(*) It looks like the configuration was never tested with
    INTEL_SOC_PMIC=n. The line in Makefile is actually wrong.

Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net> (supporter:ACPI)
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
2017-04-27 11:54:42 +01:00
Rafał Miłecki
6892cf07e7 thermal: bcm2835: move to the broadcom subdirectory
We already have 2 Broadcom drivers and at least 1 more is coming. This
made us create broadcom subdirectory where bcm2835 should be moves now.

Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-23 08:55:37 -07:00
Steve Twiss
608567aac3 thermal: da9062/61: Thermal junction temperature monitoring driver
Add junction temperature monitoring supervisor device driver, compatible
with the DA9062 and DA9061 PMICs. A MODULE_DEVICE_TABLE() macro is added.

If the PMIC's internal junction temperature rises above T_WARN (125 degC)
an interrupt is issued. This T_WARN level is defined as the
THERMAL_TRIP_HOT trip-wire inside the device driver.

The thermal triggering mechanism is interrupt based and happens when the
temperature rises above a given threshold level. The component cannot
return an exact temperature, it only has knowledge if the temperature is
above or below a given threshold value. A status bit must be polled to
detect when the temperature falls below that threshold level again. A
kernel work queue is configured to repeatedly poll and detect when the
temperature falls below this trip-wire, between 1 and 10 second intervals
(defaulting at 3 seconds).

This scheme is provided as an example. It would be expected that any
final implementation will also include a notify() function and any of these
settings could be altered to match the application where appropriate.

When over-temperature is reached, the interrupt from the DA9061/2 will be
repeatedly triggered. The IRQ is therefore disabled when the first
over-temperature event happens and the status bit is polled using a
work-queue until it becomes false.

This strategy is designed to allow the periodic transmission of uevents
(HOT trip point) as the first level of temperature supervision method. It
is intended for non-invasive temperature control, where the necessary
measures for cooling the system down are left to the host software. Once
the temperature falls again, the IRQ is re-enabled so a new critical
over-temperature event can be detected.

Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-06 21:48:03 -07:00
Rafał Miłecki
a94cb7eeec thermal: broadcom: add Northstar thermal driver
Northstar is a SoC family commonly used in home routers. This commit
adds a driver for checking CPU temperature. As Northstar Plus seems to
also have this IP block this new symbol gets ARCH_BCM_IPROC dependency.

Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Jon Mason <jon.mason@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-06 21:45:19 -07:00
Stefan Wahren
bcb7dd9ef2 thermal: bcm2835: add thermal driver for bcm2835 SoC
Add basic thermal driver for bcm2835 SoC.

This driver currently make sure that tsense HW block is set up
correctly.

Tested-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-04-01 09:30:28 -07:00
Viresh Kumar
19678ffb9f cpufreq: dbx500: Manage cooling device from cpufreq driver
The best place to register the CPU cooling device is from the cpufreq
driver as we would know if all the resources are already available or
not. That's what is done for the cpufreq-dt.c driver as well.

The cpu-cooling driver for dbx500 platform was just (un)registering
with the thermal framework and that can be handled easily by the cpufreq
driver as well and in proper sequence as well.

Get rid of the cooling driver and its its users and manage everything
from the cpufreq driver instead.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Linus Walleij <linus.walleij@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-03-16 00:14:31 +01:00
Baoyou Xie
50fdd36f33 thermal: zx2967: add thermal driver for ZTE's zx2967 family
This patch adds thermal driver for ZTE's zx2967 family.

Signed-off-by: Baoyou Xie <baoyou.xie@linaro.org>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-02-18 16:36:12 -08:00
Wolfram Sang
564e73d283 thermal: rcar_gen3_thermal: Add R-Car Gen3 thermal driver
Add support for R-Car Gen3 thermal sensors. Polling only for now,
interrupts will be added incrementally. Same goes for reading fuses.
This is documented already, but no hardware available for now.

Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Thao Nguyen <thao.nguyen.yb@rvc.renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
[Niklas: document and rework temperature calculation]
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2017-01-19 20:15:28 -08:00
Leo Yan
f05f482126 thermal: hisilicon: fix for dependency
The thermal driver is standalone driver which is used to enable
thermal sensors, so it can be used with any cooling device and
should not bind with CPU cooling device driver.

This original patch is suggested by Amit Kucheria; so it's to
polish the dependency in Kconfig, and remove the dependency with
CPU_THERMAL.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-11-23 10:07:35 +08:00
Zhang Rui
040a3eadf0 Merge branches 'thermal-soc', 'thermal-core', 'thermal-intel' and 'thermal-tegra-hw-throttle' into next 2016-09-27 14:03:19 +08:00
Laxman Dewangan
ec4664b3fd thermal: max77620: Add thermal driver for reporting junction temp
Maxim Semiconductor Max77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.

Add thermal driver to register PMIC die temperature as thermal
zone sensor and capture the die temperature warning interrupts
to notifying the client.

Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Peter Robinson
eea6a36439 thermal: imx: depend on imx SoC arch
Not much use unless the SoC is selected so depend on the ARCH_MXC
and COMPILE_TEST like all the other thermal drivers.

v2: drop extraneous OF

Signed-off-by: Peter Robinson <pbrobinson@gmail.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Jia Hongtao
43528445f6 thermal: qoriq: Add thermal management support
This driver add thermal management support by enabling TMU (Thermal
Monitoring Unit) on QorIQ platform.

It's based on thermal of framework:
- Trip points defined in device tree.
- Cpufreq as cooling device registered in qoriq cpufreq driver.

Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Rajendra Nayak
9066073c6c thermal: qcom: tsens: Add a skeletal TSENS drivers
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.

Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.

Also add the required device tree bindings which can be used
to describe the TSENS device in DT.

Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:02:16 +08:00
Bin Gao
b474303ffd thermal: add Intel BXT WhiskeyCove PMIC thermal driver
This change adds support for Intel BXT Whiskey Cove PMIC thermal
driver which is intended to handle the alert interrupts triggered
upon thermal trip point cross and notify the thermal framework
appropriately with the zone, temp, crossed trip and event details.

Signed-off-by: Yegnesh S Iyer <yegnesh.s.iyer@intel.com>
Signed-off-by: Bin Gao <bin.gao@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-06 06:55:33 +08:00
Linus Torvalds
bfb764440d Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:

 - Introduce generic ADC thermal driver, based on OF thermal (Laxman
   Dewangan)

 - Introduce new thermal driver for Tango chips (Marc Gonzalez)

 - Rockchip driver support for RK3399, RK3366, and some fixes (Caesar
   Wang, Elaine Zhang and Shawn Lin)

 - Add CPU power cooling model to Mediatek thermal driver (Dawei Chien)

 - Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin)

 - TI thermal driver gained a new maintainer (Keerthy).

 - Enabled powerclamp driver by checking CPU feature and package cstate
   counter instead of CPU whitelist (Jacob Pan)

 - Various fixes on thermal governor, OF thermal, Tegra, and RCAR

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits)
  thermal: tango: initialize TEMPSI_CFG
  thermal: rockchip: use the usleep_range instead of udelay
  thermal: rockchip: add the notes for better reading
  thermal: rockchip: Support RK3366 SoCs in the thermal driver
  thermal: rockchip: handle the power sequence for tsadc controller
  thermal: rockchip: update the tsadc table for rk3399
  thermal: rockchip: fixes the code_to_temp for tsadc driver
  thermal: rockchip: disable thermal->clk in err case
  thermal: tegra: add Tegra132 specific SOC_THERM driver
  thermal: fix ptr_ret.cocci warnings
  thermal: mediatek: Add cpu dynamic power cooling model.
  thermal: generic-adc: Add ADC based thermal sensor driver
  thermal: generic-adc: Add DT binding for ADC based thermal sensor
  thermal: tegra: fix static checker warning
  thermal: tegra: mark PM functions __maybe_unused
  thermal: add temperature sensor support for tango SoC
  thermal: hisilicon: fix IRQ imbalance enabling
  thermal: hisilicon: support to use any sensor
  thermal: rcar: Remove binding docs for r8a7794
  thermal: tegra: add PM support
  ...
2016-05-26 09:23:43 -07:00
Laxman Dewangan
b3aef78f76 thermal: generic-adc: Add ADC based thermal sensor driver
In some of platform, thermal sensors like NCT thermistors are
connected to the one of ADC channel. The temperature is read by
reading the voltage across the sensor resistance via ADC. Lookup
table for ADC read value to temperature is referred to get
temperature. ADC is read via IIO framework.

Add support for thermal sensor driver which read the voltage across
sensor resistance from ADC through IIO framework.

Acked-by: Jonathan Cameron <jic23@kernel.org>
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:31 -07:00
Marc Gonzalez
0b58c08b59 thermal: add temperature sensor support for tango SoC
The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.

This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.

Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:30 -07:00
Wei Ni
a4dff94ffd thermal: tegra: move tegra thermal files into tegra directory
Move Tegra soctherm driver to tegra directory, it's easy to maintain
and add more new function support for Tegra platforms.
This will also help to split soctherm driver into common parts and
chip specific data related parts.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:27 -07:00
Aaron Lu
a3c89334f0 Thermal / ACPI / video: add INT3406 thermal driver
INT3406 ACPI device object resembles an ACPI video output device, but its
_BCM is said to be deprecated and should not be used. So we will make
use of the raw interface to do the actual cooling.

Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2016-05-11 02:15:31 +02:00
Johannes Berg
a6f4850dbc thermal: fix Mediatek thermal controller build
At least with CONFIG_COMPILE_TEST, there's no reason to assume
that CONFIG_RESET_CONTROLLER is set, but the code for this
controller requires it since it calls device_reset().

Make CONFIG_MTK_THERMAL properly depend on CONFIG_RESET_CONTROLLER.

Signed-off-by: Johannes Berg <johannes.berg@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-20 21:13:21 -07:00
Randy Dunlap
62e14f6fd3 thermal: fix mtk_thermal build dependency
Fix build errors when MTK_THERMAL=y and NVMEM=m by preventing that
Kconfig combination.

drivers/built-in.o: In function `mtk_thermal_probe':
mtk_thermal.c:(.text+0xffa8f): undefined reference to `nvmem_cell_get'
mtk_thermal.c:(.text+0xffabe): undefined reference to `nvmem_cell_read'
mtk_thermal.c:(.text+0xffac9): undefined reference to `nvmem_cell_put'

Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: <linux-pm@vger.kernel.org>
Cc: Sascha Hauer <s.hauer@pengutronix.de>
Cc: Hanyi Wu <hanyi.wu@mediatek.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-20 16:22:46 -07:00
Zhang Rui
032f4a1e5a Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc 2016-03-15 07:53:01 +08:00
Eduardo Valentin
74e5053cd7 thermal: mtk: allow compile testing on UM
Following the fix on thermal Kconfig, this
patch adds dependency on HAS_IOMEM so driver
properly compile test on UM arch.

Cc: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Matthias Brugger <matthias.bgg@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-mediatek@lists.infradead.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-08 13:34:25 -08:00
Krzysztof Kozlowski
bf82c350e9 thermal: Fix build error of missing devm_ioremap_resource on UM
The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:

drivers/built-in.o: In function `kirkwood_thermal_probe':
kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource'
drivers/built-in.o: In function `exynos_tmu_probe':
exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap'

The users of devm_ioremap_resource() which are compile-testable should
depend on HAS_IOMEM.

Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-08 12:22:35 -08:00
Simon Horman
8255e4e237 thermal: rcar: Use ARCH_RENESAS
Make use of ARCH_RENESAS in place of ARCH_SHMOBILE.

This is part of an ongoing process to migrate from ARCH_SHMOBILE to
ARCH_RENESAS the motivation for which being that RENESAS seems to be a more
appropriate name than SHMOBILE for the majority of Renesas ARM based SoCs.

Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-08 11:55:58 -08:00
Luis de Bethencourt
527860fe46 thermal: db8500_cpufreq_cooling: Compile with COMPILE_TEST
This driver only has runtime but no build time dependencies, so it can be
built for testing purposes if the Kconfig COMPILE_TEST option is enabled.

This is useful to have more build coverage and make sure that drivers are
not affected by changes that could cause build regressions.

Signed-off-by: Luis de Bethencourt <luisbg@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-08 11:29:29 -08:00
Sascha Hauer
a92db1c808 thermal: Add Mediatek thermal controller support
This adds support for the Mediatek thermal controller found on MT8173
and likely other SoCs.
The controller is a bit special. It does not have its own ADC, instead
it controls the on-SoC AUXADC via AHB bus accesses. For this reason
we need the physical address of the AUXADC. Also it controls a mux
using AHB bus accesses, so we need the APMIXEDSYS physical address aswell.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-02-18 07:20:36 -08:00
Arnd Bergmann
26716ce124 thermal: allow u8500-thermal driver to be a module
When the thermal subsystem is a loadable module, the u8500 driver
fails to build:

drivers/thermal/built-in.o: In function `db8500_thermal_probe':
db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register'
drivers/thermal/built-in.o: In function `db8500_thermal_work':
db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update'

This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-02-09 14:18:23 -08:00
Arnd Bergmann
4d2f1794c0 thermal: allow spear-thermal driver to be a module
When the thermal subsystem is a loadable module, the spear driver
fails to build:

drivers/thermal/built-in.o: In function `spear_thermal_exit':
spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister'
drivers/thermal/built-in.o: In function `spear_thermal_probe':
spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register'

This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-02-09 14:16:08 -08:00
Arnd Bergmann
e4217468ae Revert "thermal: qcom_spmi: allow compile test"
This just caused build errors:

warning: (QCOM_SPMI_TEMP_ALARM) selects REGMAP_SPMI which has unmet direct dependencies (SPMI)
drivers/built-in.o: In function `regmap_spmi_ext_gather_write':
:(.text+0x609b0): undefined reference to `spmi_ext_register_write'
:(.text+0x609f0): undefined reference to `spmi_ext_register_writel'

While it's generally a good idea to allow compile testing, in this
case, it just doesn't work, so reverting the patch that
introduced the compile-test variant seems the most appropriate
solution.

Note that SPMI also has a 'depends on ARCH_QCOM || COMPILE_TEST'
statement, so we should be able to enable SPMI on all architectures
for compile testing already.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: cb7fb4d342 ("thermal: qcom_spmi: allow compile test")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-11-23 15:33:56 -08:00
Zhang Rui
7c5b2759bf Merge branches 'thermal-core', 'thermal-intel' and 'thermal-soc' into next 2015-11-06 09:32:10 +08:00
Ørjan Eide
a76caf55e5 thermal: Add devfreq cooling
Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.

The device must use devfreq.  In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-10-30 10:21:01 -07:00
Srinivas Pandruvada
98cadf25da thermal: kconfig: select THERMAL_WRITABLE_TRIPS for x86 thermal
After the commit "thermal: core: Add Kconfig option to enable writable
trips", by default the trips are read only. This cause user space thermal
controllers to poll for temperature as they can't set temperature
thresholds for getting a notification via uevents. These programs use RW
trip in a zone to register thresholds. Since we need to enable the new
config introduced by above commit to allow writable trips, selecting
CONFIG_THERMAL_WRITABLE_TRIP for x86 thermal drivers.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-10-10 09:49:21 +08:00
Eduardo Valentin
ec2feb475f thermal: ti-soc: Kconfig fix to avoid menu showing wrongly
Move the dependencies to menu, so we avoid showing it wrongly.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-omap@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:53 -07:00
Eduardo Valentin
cb7fb4d342 thermal: qcom_spmi: allow compile test
Adding COMPILE_TEST flag to qcom_spmi driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:52 -07:00