Commit graph

9 commits

Author SHA1 Message Date
Javier Martinez Canillas
8093a116b4 thermal: db8500: Fix module autoload
If the driver is built as a module, autoload won't work because the module
alias information is not filled. So user-space can't match the registered
device with the corresponding module.

Export the module alias information using the MODULE_DEVICE_TABLE() macro.

Before this patch:

$ modinfo drivers/thermal/db8500_thermal.ko | grep alias
$

After this patch:

$ modinfo drivers/thermal/db8500_thermal.ko | grep alias
alias:          of:N*T*Cstericsson,db8500-thermalC*
alias:          of:N*T*Cstericsson,db8500-thermal

Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-11-23 10:07:35 +08:00
Srinivas Pandruvada
0e70f466fb thermal: Enhance thermal_zone_device_update for events
Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27 14:35:21 +08:00
Sascha Hauer
17e8351a77 thermal: consistently use int for temperatures
The thermal code uses int, long and unsigned long for temperatures
in different places.

Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.

'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.

Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-08-03 23:15:50 +08:00
Kapileshwar Singh
6cd9e9f629 thermal: of: fix cooling device weights in device tree
Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be.  The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.

Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.

While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:50 -07:00
Wolfram Sang
bbc3798340 thermal: drop owner assignment from platform_drivers
A platform_driver does not need to set an owner, it will be populated by the
driver core.

Signed-off-by: Wolfram Sang <wsa@the-dreams.de>
2014-10-20 16:21:42 +02:00
Axel Lin
4c7fa83aa5 thermal: db8500: Fix missing mutex_unlock() in probe error paths
Signed-off-by: Axel Lin <axel.lin@ingics.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 22:08:08 +08:00
Axel Lin
f534e9bf80 thermal: db8500: Fix checking return value of thermal_zone_device_register
thermal_zone_device_register() returns ERR_PTR on error, thus use
IS_ERR rather than IS_ERR_OR_NULL to check return value.

Signed-off-by: Axel Lin <axel.lin@ingics.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 22:07:52 +08:00
Sachin Kamat
c313637641 thermal: db8500: Use of_match_ptr() macro in db8500_thermal.c
This eliminates having an #ifdef returning NULL for the case
when OF is disabled.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Reviewed-by: Hongbo Zhang <hongbo.zhang@stericsson.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:39:32 +08:00
hongbo.zhang
aa1acb0451 Thermal: Add ST-Ericsson DB8500 thermal driver.
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically.  The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:50:34 +08:00