As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-14-daniel.lezcano@linexp.org
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The function devm_platform_ioremap_resource has already contains error
message, so remove the redundant dev_err here.
Signed-off-by: Tang Bin <tangbin@cmss.chinamobile.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210222061105.6008-1-tangbin@cmss.chinamobile.com
Many monitoring tools read the CPU temperature using the hwmon
interface. Expose the thermal sensors on Amlogic boards as hwmon
devices.
Without this lm_sensors' "sensors" tool does not find any temperature
sensors. Now it prints:
cpu_thermal-virtual-0
Adapter: Virtual device
temp1: +44.7 C (crit = +110.0 C)
ddr_thermal-virtual-0
Adapter: Virtual device
temp1: +45.9 C (crit = +110.0 C)
Signed-off-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com>
Reviewed-by: Neil Armstrong <narmstrong@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201115190658.631578-1-martin.blumenstingl@googlemail.com
Fix up the following warning when compiled with make W=1:
linux.git/drivers/thermal/amlogic_thermal.c:78: warning: Function parameter or member 'A' not described in 'amlogic_thermal_soc_calib_data'
linux.git/drivers/thermal/amlogic_thermal.c:78: warning: Function parameter or member 'B' not described in 'amlogic_thermal_soc_calib_data'
linux.git/drivers/thermal/amlogic_thermal.c:78: warning: Function parameter or member 'm' not described in 'amlogic_thermal_soc_calib_data'
linux.git/drivers/thermal/amlogic_thermal.c:78: warning: Function parameter or member 'n' not described in 'amlogic_thermal_soc_calib_data'
Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/139c9191f1a18d528b5f94376facf40291d28244.1574242756.git.amit.kucheria@linaro.org
Amlogic G12A and G12B SoCs integrate two thermal sensors
with the same design. One is located close to the DDR controller
and the other one is located close to the PLLs (between the CPU and GPU).
The calibration data for each of the thermal sensors instance is stored
in a different location within the AO region.
Implement reading the temperature from each thermal sensor.
The IP block has more functionality, which may be added to this driver
in the future:
- chip reset when the temperature exceeds a configurable threshold
- up to four interrupts when the temperature has risen above a
configurable threshold
- up to four interrupts when the temperature has fallen below a
configurable threshold
Tested-by: Christian Hewitt <christianshewitt@gmail.com>
Tested-by: Kevin Hilman <khilman@baylibre.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Guillaume La Roque <glaroque@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191004090114.30694-3-glaroque@baylibre.com
Daniel Lezcano