The .remove() callback for a platform driver returns an int which makes
many driver authors wrongly assume it's possible to do error handling by
returning an error code. However the value returned is ignored (apart
from emitting a warning) and this typically results in resource leaks.
To improve here there is a quest to make the remove callback return
void. In the first step of this quest all drivers are converted to
.remove_new(), which already returns void. Eventually after all drivers
are converted, .remove_new() will be renamed to .remove().
Trivially convert this driver from always returning zero in the remove
callback to the void returning variant.
Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Cc: Maxime Coquelin <mcoquelin.stm32@gmail.com>
Cc: Alexandre Torgue <alexandre.torgue@foss.st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230307133735.90772-6-daniel.lezcano@linaro.org
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
As the name states "thermal_core.h" is the header file for the core
components of the thermal framework.
Too many drivers are including it. Hopefully the recent cleanups
helped to self encapsulate the code a bit more and prevented the
drivers to need this header.
Remove this inclusion in every place where it is possible.
Some other drivers did a confusion with the core header and the one
exported in linux/thermal.h. They include the former instead of the
latter. The changes also fix this.
The tegra/soctherm driver still remains as it uses an internal
function which need to be replaced.
The Intel HFI driver uses the netlink internal framework core and
should be changed to prevent to deal with the internals.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> # armada_thermal.c
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> # uniphier_thermal.c
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> # rcar_gen3_thermal.c
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> # amlogic_thermal.c
Acked-by: Florian Fainelli <f.fainelli@gmail.com> # bcm2835_thermal.c
Acked-by: Thierry Reding <treding@nvidia.com> # tegra30-tsensor.c
Link: https://lore.kernel.org/r/20230206153432.1017282-1-daniel.lezcano@linaro.org
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Convert platform_get_resource(), devm_ioremap_resource() to a single
call to devm_platform_get_and_ioremap_resource(), as this is exactly
what this function does.
Signed-off-by: Minghao Chi <chi.minghao@zte.com.cn>
Signed-off-by: ye xingchen <ye.xingchen@zte.com.cn>
Link: https://lore.kernel.org/r/202211171409524332954@zte.com.cn
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-13-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
The function “platform_get_irq” can log an error already.
Thus omit redundant messages for the exception handling in the
calling functions.
This issue was detected by using the Coccinelle software.
Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/05f49ae7-5cc7-d6a0-fc3d-abaf2a0b373c@web.de
The spinlock pkg_temp_lock has the potential of being taken in atomic
context because it can be acquired from the thermal IRQ vector.
It's static and limited scope so go ahead and make it a raw spinlock.
Signed-off-by: Clark Williams <williams@redhat.com>
Signed-off-by: Sebastian Andrzej Siewior <bigeasy@linutronix.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20191008110021.2j44ayunal7fkb7i@linutronix.de
With the STM32 thermal peripheral, it is not possible to dump the
temperature that has caused the interrupt.
When the temperature reaches the low threshold, we generally read
a temperature that is a little bit higher than the low threshold.
This maybe due to sampling precision, and also because the CPU becomes
hotter when it quits WFI mode.
In that case, the framework does not change the trip points. This leads
to a lot of low threshold interrupts.
The fix is to set the low threshold value 0.5 degrees Celsius
below the actual request.
The problem is not so frequent with the high threshold and it would
no be a good idea to set the threshold value higher than the request.
Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-7-p.paillet@st.com
Change the way of computing to avoid rounds by 1 or 2 degrees.
Also simplify the sampling time management that is hard-coded
to maximum value during probe.
Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-6-p.paillet@st.com
Let the thermal framework handle the trip points instead
of custom code inside the driver. This is backward compatible,
simplifies the driver and offers the possibility to the user
to set any trip point he needs.
stm_thermal_set_trips callback that is registered to
set_trips ops to handle the low and high thresholds and replaces
stm_thermal_set_threshold and stm_thermal_update_threshold functions.
modify irq enable to handle the thresholds.
Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-5-p.paillet@st.com
In case of CPU reset, the interrupts could be enabled at boot time.
Disable interrupts and clear flags.
Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-4-p.paillet@st.com
Be sure get_temp returns an error while disabling or enabling the device.
Set THERMAL_DEVICE_ENABLED state at the end of power on function.
Set THERMAL_DEVICE_DISABLED state at the beginning of power off function.
Signed-off-by: Pascal Paillet <p.paillet@st.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200110101605.24984-3-p.paillet@st.com
We should get 'driver_data' from 'struct device' directly. Going via
platform_device is an unneeded step back and forth.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Simon Horman <horms+renesas@verge.net.au>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Adding brackets allows to multiply the register value,
masked by TS1_RAMP_COEFF_MASK, by an ADJUST value
properly and not to multiply ADJUST by register value and
then mask the whole.
Fixes: 1d693155 ("thermal: add stm32 thermal driver")
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Calling stm_thermal_read_factory_settings before clocking
internal peripheral causes bad register values and makes
temperature computation wrong.
Calling stm_thermal_read_factory_settings inside
stm_thermal_prepare fixes this problem as internal
peripheral is well clocked at this stage.
Fixes: 1d693155 ("thermal: add stm32 thermal driver")
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Add support for DTS thermal sensor that can be
found on some STM32 platforms.
This driver is based on OF and works in interrupt
mode.
It offers two temperature trip points:
passive and critical. The first is intended for
passive cooling notification while the second is
used for over-temperature reset.
Signed-off-by: David Hernandez Sanchez <david.hernandezsanchez@st.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
