Greg Kroah-Hartman 213db49399 usb: changes for v3.18 merge window ... Quite big pull request this time. Audio and UVC gadgets can now be used with our configfs-based binding. We have three PHY drivers being removed because a new one has been added using new PHY framework. Gadget framework got a new ->reset callback preparing for some other changes to come on next merge window. A few new drivers came in as well; among those we have a new UDC driver from Xilinx and two new glue layers for DWC3 (ST and Qualcomm). DWC3 also learned about tracepoints which will help debugging quite a bit. Other than that, a big series of non-critical fixes and cleanups. All patches have been on linux-next for quite a bit of time and I boot tested these changes on platforms I have access to and work with mainline. Signed-of-by: Felipe Balbi <balbi@ti.com> -----BEGIN PGP SIGNATURE----- Version: GnuPG v1 iQIcBAABAgAGBQJUGu+JAAoJEIaOsuA1yqREyekP/3uIW2Y5Z1/51Zk7LZGBaqXJ ODxfwe9rE2ZQkN6OfwVzLKbFKmP6Fc+1FFBahza8hmyqgW7V9KaoRiAWhjkwkpDj 5qgmLVbXIYLlLUWCGgQnx0sV3S46ubE8XZDnyHlz0mT66+ee915qGpbbWa83hI7S lbPr/AybpldbBwu0tD7yCTMx5Q+92KH0ZGzzNH9lNpzV8X2qA5+9IsnlRhcRCKBp GZnZSHLkOBQitrCK+NTjM+2XJ5WFOmlfZd13w7YPnPWz23yImJlRp697bqaKGHDX BnPMsoSNVtT7uMcge+LRcyJ0RgWiaIL9TODVLPQLm/tV1gp0OwF53HF+0o8usf4z 9D+NXC3BVxCAkjv5HFqFaEAyZ0km0m+1/VE8opAvT0u8ySNwE6uXXczBLN2GCMdJ N2djwR/9eMRQsbDVweZoGOgO2FEqKx2nEfsZfkX1xmJoRkvPl2ssFejdSZw2oD3N lJpb1rg6Ko+TURxKDaqZY/0Uu/8zz6Waqs2AmhV4QHlB2RZWxBW8MrPe2hIB5e97 UJjgOdHBBEzXlj0kLwbRojWyDb4JokpyyQx3ZuO1A3r3m1hrGgM0GRcW7k09IxM9 W6UQow1B4l3tfMpOOFO8xe7nUzN8ekj85lIdgUl3BTBGpxexvViv6APiGVt8p8lS 7jbEldb3DyAnqJldepdQ =VHzN -----END PGP SIGNATURE----- Merge tag 'usb-for-v3.18' of git://git.kernel.org/pub/scm/linux/kernel/git/balbi/usb into usb-next Felipe writes: usb: changes for v3.18 merge window Quite big pull request this time. Audio and UVC gadgets can now be used with our configfs-based binding. We have three PHY drivers being removed because a new one has been added using new PHY framework. Gadget framework got a new ->reset callback preparing for some other changes to come on next merge window. A few new drivers came in as well; among those we have a new UDC driver from Xilinx and two new glue layers for DWC3 (ST and Qualcomm). DWC3 also learned about tracepoints which will help debugging quite a bit. Other than that, a big series of non-critical fixes and cleanups. All patches have been on linux-next for quite a bit of time and I boot tested these changes on platforms I have access to and work with mainline. Signed-of-by: Felipe Balbi <balbi@ti.com>		2014-09-19 15:18:00 -07:00
..
bindings	usb: changes for v3.18 merge window	2014-09-19 15:18:00 -07:00
00-INDEX
booting-without-of.txt
changesets.txt	of: Transactional DT support.	2014-07-23 17:29:15 -06:00
todo.txt	of: Add todo tasklist for Devicetree	2014-07-23 17:33:01 -06:00
usage-model.txt