Jussi Maki 6d5f1ef838 bonding: Fix negative jump label count on nested bonding ... With nested bonding devices the nested bond device's ndo_bpf was called without a program causing it to decrement the static key without a prior increment leading to negative count. Fix the issue by 1) only calling slave's ndo_bpf when there's a program to be loaded and 2) only decrement the count when a program is unloaded. Fixes: 9e2ee5c7e7 ("net, bonding: Add XDP support to the bonding driver") Reported-by: syzbot+30622fb04ddd72a4d167@syzkaller.appspotmail.com Signed-off-by: Jussi Maki <joamaki@gmail.com> Signed-off-by: David S. Miller <davem@davemloft.net>		2021-09-06 13:12:09 +01:00
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bond_3ad.c	bonding: add new option lacp_active	2021-08-03 11:50:22 +01:00
bond_alb.c	net: bonding: bond_alb: Remove the dependency on ipx network layer	2021-08-07 09:47:05 +01:00
bond_debugfs.c	net: bonding: remove unnecessary braces	2021-05-20 15:43:24 -07:00
bond_main.c	bonding: Fix negative jump label count on nested bonding	2021-09-06 13:12:09 +01:00
bond_netlink.c	bonding: add new option lacp_active	2021-08-03 11:50:22 +01:00
bond_options.c	bonding: add new option lacp_active	2021-08-03 11:50:22 +01:00
bond_procfs.c	bonding: add new option lacp_active	2021-08-03 11:50:22 +01:00
bond_sysfs.c	bonding: add new option lacp_active	2021-08-03 11:50:22 +01:00
bond_sysfs_slave.c	bonding: wait for sysfs kobject destruction before freeing struct slave	2020-11-21 13:07:00 -08:00
bonding_priv.h	drivers: Remove inclusion of vermagic header	2020-04-21 13:27:37 -07:00
Makefile