mirror of
https://git.kernel.org/pub/scm/linux/kernel/git/stable/linux.git
synced 2024-09-12 21:57:43 +00:00
c5aec4c76a
Pull powerpc updates from Ben Herrenschmidt: "Here is the bulk of the powerpc changes for this merge window. It got a bit delayed in part because I wasn't paying attention, and in part because I discovered I had a core PCI change without a PCI maintainer ack in it. Bjorn eventually agreed it was ok to merge it though we'll probably improve it later and I didn't want to rebase to add his ack. There is going to be a bit more next week, essentially fixes that I still want to sort through and test. The biggest item this time is the support to build the ppc64 LE kernel with our new v2 ABI. We previously supported v2 userspace but the kernel itself was a tougher nut to crack. This is now sorted mostly thanks to Anton and Rusty. We also have a fairly big series from Cedric that add support for 64-bit LE zImage boot wrapper. This was made harder by the fact that traditionally our zImage wrapper was always 32-bit, but our new LE toolchains don't really support 32-bit anymore (it's somewhat there but not really "supported") so we didn't want to rely on it. This meant more churn that just endian fixes. This brings some more LE bits as well, such as the ability to run in LE mode without a hypervisor (ie. under OPAL firmware) by doing the right OPAL call to reinitialize the CPU to take HV interrupts in the right mode and the usual pile of endian fixes. There's another series from Gavin adding EEH improvements (one day we *will* have a release with less than 20 EEH patches, I promise!). Another highlight is the support for the "Split core" functionality on P8 by Michael. This allows a P8 core to be split into "sub cores" of 4 threads which allows the subcores to run different guests under KVM (the HW still doesn't support a partition per thread). And then the usual misc bits and fixes ..." [ Further delayed by gmail deciding that BenH is a dirty spammer. Google knows. ] * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/benh/powerpc: (155 commits) powerpc/powernv: Add missing include to LPC code selftests/powerpc: Test the THP bug we fixed in the previous commit powerpc/mm: Check paca psize is up to date for huge mappings powerpc/powernv: Pass buffer size to OPAL validate flash call powerpc/pseries: hcall functions are exported to modules, need _GLOBAL_TOC() powerpc: Exported functions __clear_user and copy_page use r2 so need _GLOBAL_TOC() powerpc/powernv: Set memory_block_size_bytes to 256MB powerpc: Allow ppc_md platform hook to override memory_block_size_bytes powerpc/powernv: Fix endian issues in memory error handling code powerpc/eeh: Skip eeh sysfs when eeh is disabled powerpc: 64bit sendfile is capped at 2GB powerpc/powernv: Provide debugfs access to the LPC bus via OPAL powerpc/serial: Use saner flags when creating legacy ports powerpc: Add cpu family documentation powerpc/xmon: Fix up xmon format strings powerpc/powernv: Add calls to support little endian host powerpc: Document sysfs DSCR interface powerpc: Fix regression of per-CPU DSCR setting powerpc: Split __SYSFS_SPRSETUP macro arch: powerpc/fadump: Cleaning up inconsistent NULL checks ...
145 lines
4.1 KiB
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145 lines
4.1 KiB
Text
Device tree binding vendor prefix registry. Keep list in alphabetical order.
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This isn't an exhaustive list, but you should add new prefixes to it before
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using them to avoid name-space collisions.
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abilis Abilis Systems
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active-semi Active-Semi International Inc
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ad Avionic Design GmbH
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adi Analog Devices, Inc.
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aeroflexgaisler Aeroflex Gaisler AB
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ak Asahi Kasei Corp.
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allwinner Allwinner Technology Co., Ltd.
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altr Altera Corp.
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amcc Applied Micro Circuits Corporation (APM, formally AMCC)
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amd Advanced Micro Devices (AMD), Inc.
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ams AMS AG
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amstaos AMS-Taos Inc.
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apm Applied Micro Circuits Corporation (APM)
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arm ARM Ltd.
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armadeus ARMadeus Systems SARL
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atmel Atmel Corporation
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auo AU Optronics Corporation
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avago Avago Technologies
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bosch Bosch Sensortec GmbH
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brcm Broadcom Corporation
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buffalo Buffalo, Inc.
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calxeda Calxeda
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capella Capella Microsystems, Inc
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cavium Cavium, Inc.
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cdns Cadence Design Systems Inc.
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chrp Common Hardware Reference Platform
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chunghwa Chunghwa Picture Tubes Ltd.
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cirrus Cirrus Logic, Inc.
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cortina Cortina Systems, Inc.
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crystalfontz Crystalfontz America, Inc.
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dallas Maxim Integrated Products (formerly Dallas Semiconductor)
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davicom DAVICOM Semiconductor, Inc.
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denx Denx Software Engineering
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digi Digi International Inc.
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dlink D-Link Corporation
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dmo Data Modul AG
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ebv EBV Elektronik
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edt Emerging Display Technologies
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emmicro EM Microelectronic
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epfl Ecole Polytechnique Fédérale de Lausanne
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epson Seiko Epson Corp.
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est ESTeem Wireless Modems
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eukrea Eukréa Electromatique
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excito Excito
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fsl Freescale Semiconductor
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GEFanuc GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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gef GE Fanuc Intelligent Platforms Embedded Systems, Inc.
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globalscale Globalscale Technologies, Inc.
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gmt Global Mixed-mode Technology, Inc.
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google Google, Inc.
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gumstix Gumstix, Inc.
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haoyu Haoyu Microelectronic Co. Ltd.
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hisilicon Hisilicon Limited.
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honeywell Honeywell
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hp Hewlett Packard
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i2se I2SE GmbH
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ibm International Business Machines (IBM)
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idt Integrated Device Technologies, Inc.
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iom Iomega Corporation
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img Imagination Technologies Ltd.
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intel Intel Corporation
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intercontrol Inter Control Group
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isee ISEE 2007 S.L.
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isl Intersil
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karo Ka-Ro electronics GmbH
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keymile Keymile GmbH
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lacie LaCie
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lantiq Lantiq Semiconductor
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lg LG Corporation
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linux Linux-specific binding
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lsi LSI Corp. (LSI Logic)
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lltc Linear Technology Corporation
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marvell Marvell Technology Group Ltd.
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maxim Maxim Integrated Products
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micrel Micrel Inc.
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microchip Microchip Technology Inc.
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mosaixtech Mosaix Technologies, Inc.
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moxa Moxa
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mpl MPL AG
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mundoreader Mundo Reader S.L.
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mxicy Macronix International Co., Ltd.
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national National Semiconductor
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neonode Neonode Inc.
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netgear NETGEAR
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newhaven Newhaven Display International
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nintendo Nintendo
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nokia Nokia
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nvidia NVIDIA
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nxp NXP Semiconductors
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onnn ON Semiconductor Corp.
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opencores OpenCores.org
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panasonic Panasonic Corporation
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phytec PHYTEC Messtechnik GmbH
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picochip Picochip Ltd
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plathome Plat'Home Co., Ltd.
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powervr PowerVR (deprecated, use img)
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qca Qualcomm Atheros, Inc.
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qcom Qualcomm Technologies, Inc
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qnap QNAP Systems, Inc.
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radxa Radxa
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raidsonic RaidSonic Technology GmbH
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ralink Mediatek/Ralink Technology Corp.
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ramtron Ramtron International
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realtek Realtek Semiconductor Corp.
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renesas Renesas Electronics Corporation
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ricoh Ricoh Co. Ltd.
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rockchip Fuzhou Rockchip Electronics Co., Ltd
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samsung Samsung Semiconductor
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sbs Smart Battery System
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schindler Schindler
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seagate Seagate Technology PLC
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sil Silicon Image
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silabs Silicon Laboratories
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simtek
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sii Seiko Instruments, Inc.
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sirf SiRF Technology, Inc.
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smsc Standard Microsystems Corporation
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snps Synopsys, Inc.
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spansion Spansion Inc.
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st STMicroelectronics
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ste ST-Ericsson
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stericsson ST-Ericsson
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synology Synology, Inc.
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ti Texas Instruments
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tlm Trusted Logic Mobility
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toradex Toradex AG
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toshiba Toshiba Corporation
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toumaz Toumaz
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usi Universal Scientifc Industrial Co., Ltd.
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v3 V3 Semiconductor
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variscite Variscite Ltd.
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via VIA Technologies, Inc.
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voipac Voipac Technologies s.r.o.
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winbond Winbond Electronics corp.
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wlf Wolfson Microelectronics
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wm Wondermedia Technologies, Inc.
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xes Extreme Engineering Solutions (X-ES)
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xlnx Xilinx
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zyxel ZyXEL Communications Corp.
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zarlink Zarlink Semiconductor
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