Linus Torvalds 583f2bcf86 - Remove duplicate error message for the amlogic driver (Tang Bin) ... - Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury) - Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund) - Remove duplicate include in ti-bandgap (Zhang Yunkai) - Assign error code in the error path in the function thermal_of_populate_bind_params() (Jia-Ju Bai) - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian King) - Use the device name instead of auto-numbering for a better identification of the cooling device (Daniel Lezcano) - Improve a bit the division accuracy in the power allocator governor (Jeson Gao) - Enable the missing third sensor on msm8976 (Konrad Dybcio) - Add QCom tsens driver co-maintainer (Thara Gopinath) - Fix memory leak and use after free errors in the core code (Daniel Lezcano) - Add the MDM9607 compatible bindings (Konrad Dybcio) - Fix trivial spello in the copyright name for Hisilicon (Hao Fang) - Fix negative index array access when converting the frequency to power in the energy model (Brian-sy Yang) - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins) - Update maintainer file for CPU cooling device section (Lukasz Luba) - Fix missing put_device on error in the Qcom tsens driver (Guangqing Zhu) - Add compatible DT binding for sm8350 (Robert Foss) - Add support for the MDM9607's tsens driver (Konrad Dybcio) - Remove duplicate error messages in thermal_mmio and the bcm2835 driver (Ruiqi Gong) - Add the Thermal Temperature Cooling driver (Zhang Rui) - Remove duplicate error messages in the Hisilicon sensor driver (Ye Bin) - Use the devm_platform_ioremap_resource_byname() function instead of a couple of corresponding calls (dingsenjie) - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei) - Add missing property in the DT thermal sensor binding (Rafał Miłecki) - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe) - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki) - Replace the thermal_notify_framework() call by a call to the thermal_zone_device_update() function. Remove the function as well as the corresponding documentation (Thara Gopinath) - Add support for the ipq8064-tsens sensor along with a set of cleanups and code preparation (Ansuel Smith) - Add a lockless __thermal_cdev_update() function to improve the locking scheme in the core code and governors (Lukasz Luba) - Fix multiple cooling device notification changes (Lukasz Luba) - Remove unneeded variable initialization (Colin Ian King) -----BEGIN PGP SIGNATURE----- iQEzBAABCAAdFiEEGn3N4YVz0WNVyHskqDIjiipP6E8FAmCRqDIACgkQqDIjiipP 6E8O2Qf5AQvSVoN9WYRBLo1+a4mkGsJ/wHQMEsOA4FVHft5/QVkRtpMNbSiyq00O YTpNuoBqiYm/tSTyzK/5Oh+0ucgm/ef4c4dTyPjZYw2GB+3rYNRAXdX/tB6Ggjl/ oUArUCoSQZjOU6Y573B05rcHp1PVM/XL9LgD1uX76tXA1MaGvsyC0cyPRAdOANke W83BWI0XMhv8B1bZwHVB2Oft5x6HhqWBl3HKbNOmPEMtwkqqBCFAqB0wNEH88ZTf 2hyBjBoZQHdMkJsC0piMvIyAjHZiIjQB47VWz31EvKB3/E28xCqRqPViPq9QbrA5 got0+oDbxI96T024ndXRomc0SSxZnw== =5THg -----END PGP SIGNATURE----- Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux Pull thermal updates from Daniel Lezcano: - Remove duplicate error message for the amlogic driver (Tang Bin) - Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury) - Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund) - Remove duplicate include in ti-bandgap (Zhang Yunkai) - Assign error code in the error path in the function thermal_of_populate_bind_params() (Jia-Ju Bai) - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian King) - Use the device name instead of auto-numbering for a better identification of the cooling device (Daniel Lezcano) - Improve a bit the division accuracy in the power allocator governor (Jeson Gao) - Enable the missing third sensor on msm8976 (Konrad Dybcio) - Add QCom tsens driver co-maintainer (Thara Gopinath) - Fix memory leak and use after free errors in the core code (Daniel Lezcano) - Add the MDM9607 compatible bindings (Konrad Dybcio) - Fix trivial spello in the copyright name for Hisilicon (Hao Fang) - Fix negative index array access when converting the frequency to power in the energy model (Brian-sy Yang) - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins) - Update maintainer file for CPU cooling device section (Lukasz Luba) - Fix missing put_device on error in the Qcom tsens driver (Guangqing Zhu) - Add compatible DT binding for sm8350 (Robert Foss) - Add support for the MDM9607's tsens driver (Konrad Dybcio) - Remove duplicate error messages in thermal_mmio and the bcm2835 driver (Ruiqi Gong) - Add the Thermal Temperature Cooling driver (Zhang Rui) - Remove duplicate error messages in the Hisilicon sensor driver (Ye Bin) - Use the devm_platform_ioremap_resource_byname() function instead of a couple of corresponding calls (dingsenjie) - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei) - Add missing property in the DT thermal sensor binding (Rafał Miłecki) - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe) - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki) - Replace the thermal_notify_framework() call by a call to the thermal_zone_device_update() function. Remove the function as well as the corresponding documentation (Thara Gopinath) - Add support for the ipq8064-tsens sensor along with a set of cleanups and code preparation (Ansuel Smith) - Add a lockless __thermal_cdev_update() function to improve the locking scheme in the core code and governors (Lukasz Luba) - Fix multiple cooling device notification changes (Lukasz Luba) - Remove unneeded variable initialization (Colin Ian King) * tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits) thermal/drivers/mtk_thermal: Remove redundant initializations of several variables thermal/core/power allocator: Use the lockless __thermal_cdev_update() function thermal/core/fair share: Use the lockless __thermal_cdev_update() function thermal/core/fair share: Lock the thermal zone while looping over instances thermal/core/power_allocator: Update once cooling devices when temp is low thermal/core/power_allocator: Maintain the device statistics from going stale thermal/core: Create a helper __thermal_cdev_update() without a lock dt-bindings: thermal: tsens: Document ipq8064 bindings thermal/drivers/tsens: Add support for ipq8064-tsens thermal/drivers/tsens: Drop unused define for msm8960 thermal/drivers/tsens: Replace custom 8960 apis with generic apis thermal/drivers/tsens: Fix bug in sensor enable for msm8960 thermal/drivers/tsens: Use init_common for msm8960 thermal/drivers/tsens: Add VER_0 tsens version thermal/drivers/tsens: Convert msm8960 to reg_field thermal/drivers/tsens: Don't hardcode sensor slope Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation thermal/core: Remove thermal_notify_framework iwlwifi: mvm: tt: Replace thermal_notify_framework dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema ...		2021-05-05 12:46:48 -07:00
..
broadcom
intel
qcom
samsung
st
tegra
ti-soc-thermal
amlogic_thermal.c
armada_thermal.c
cpufreq_cooling.c
cpuidle_cooling.c
da9062-thermal.c
db8500_thermal.c
devfreq_cooling.c
dove_thermal.c
gov_bang_bang.c
gov_fair_share.c
gov_power_allocator.c
gov_step_wise.c
gov_user_space.c
hisi_thermal.c
imx8mm_thermal.c
imx_sc_thermal.c
imx_thermal.c
k3_bandgap.c
Kconfig
khadas_mcu_fan.c
kirkwood_thermal.c
Makefile
max77620_thermal.c
mtk_thermal.c
qoriq_thermal.c
rcar_gen3_thermal.c
rcar_thermal.c
rockchip_thermal.c
spear_thermal.c
sprd_thermal.c
sun8i_thermal.c
thermal-generic-adc.c
thermal_core.c
thermal_core.h
thermal_helpers.c
thermal_hwmon.c
thermal_hwmon.h
thermal_mmio.c
thermal_netlink.c
thermal_netlink.h
thermal_of.c
thermal_sysfs.c
uniphier_thermal.c