linux-stable/Documentation/devicetree/bindings/thermal
Biju Das f1eb64bf6d dt-bindings: mfd: dlg,da9063: Convert da9062 to json-schema
Convert the da9062 PMIC device tree binding documentation to json-schema.

Document the missing gpio child node for da9062.

While at it, update description with link to product information and
example.

The missing child node with of_compatible defined in MFD_CELL_OF is
causing the below warning message:
da9062-gpio: Failed to locate of_node [id: -1]

So, make all child nodes with of_compatible defined in struct mfd_cell
as required property for da906{1,2} devices.

The "gpio-controller" and "#gpio-cells" properties are defined in the
parent instead of gpio child node as there are existing driver users
based on these parent properties.

Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Link: https://lore.kernel.org/r/20240131102656.3379-7-biju.das.jz@bp.renesas.com
Signed-off-by: Lee Jones <lee@kernel.org>
2024-02-08 13:06:03 +00:00
..
allwinner,sun8i-a83t-ths.yaml dt-bindings: thermal: sun8i: Add binding for D1/T113s THS controller 2024-01-02 09:33:18 +01:00
amazon,al-thermal.txt
amlogic,thermal.yaml dt-bindings: thermal: Drop unneeded quotes 2023-04-07 11:18:28 +02:00
armada-thermal.txt dt-bindings: armada-thermal: Add armada-ap807-thermal compatible 2023-06-26 12:03:14 +02:00
brcm,avs-ro-thermal.yaml dt-bindings: Fix typo in comment 2022-07-21 13:14:27 -06:00
brcm,avs-tmon.yaml dt-bindings: thermal: Convert Broadcom TMON to YAML 2021-12-14 14:27:58 -06:00
brcm,bcm2835-thermal.yaml dt-bindings: thermal: convert bcm2835-thermal bindings to YAML 2023-06-26 12:03:13 +02:00
brcm,ns-thermal.yaml
brcm,sr-thermal.txt
db8500-thermal.txt
dlg,da9062-thermal.yaml dt-bindings: mfd: dlg,da9063: Convert da9062 to json-schema 2024-02-08 13:06:03 +00:00
dove-thermal.txt
fsl,scu-thermal.yaml dt-bindings: thermal: fsl,scu-thermal: Document imx8dl 2023-10-15 23:40:09 +02:00
generic-adc-thermal.yaml dt-bindings: thermal: Convert generic-adc-thermal to DT schema 2022-12-14 15:25:39 +01:00
hisilicon-thermal.txt
imx-thermal.yaml dt-bindings: imx-thermal: Add #thermal-sensor-cells property 2023-10-15 23:40:10 +02:00
imx8mm-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
kirkwood-thermal.txt
loongson,ls2k-thermal.yaml dt-bindings: thermal: loongson,ls2k-thermal: Fix binding check issues 2024-01-02 09:33:18 +01:00
max77620_thermal.txt
mediatek,lvts-thermal.yaml dt-bindings: thermal: mediatek: Add mt7988 lvts compatible 2023-10-15 23:40:09 +02:00
mediatek,thermal.yaml dt-bindings: thermal: convert Mediatek Thermal to the json-schema 2024-01-02 09:33:18 +01:00
nvidia,tegra30-tsensor.yaml dt-bindings: thermal: Add binding for Tegra30 thermal sensor 2021-07-04 18:28:04 +02:00
nvidia,tegra124-soctherm.yaml dt-bindings: thermal: nvidia,tegra124-soctherm: Add missing unevaluatedProperties on child node schemas 2023-10-15 23:40:09 +02:00
nvidia,tegra186-bpmp-thermal.yaml dt-bindings: thermal: tegra186-bpmp: Convert to json-schema 2021-12-17 14:58:05 +01:00
qcom,spmi-temp-alarm.yaml dt-bindings: thermal: qcom,spmi-temp-alarm: convert to dtschema 2022-07-28 17:29:44 +02:00
qcom-lmh.yaml dt-bindings: thermal: lmh: update maintainer address 2023-08-28 10:45:16 -05:00
qcom-spmi-adc-tm-hc.yaml dt-bindings: thermal: qcom-spmi-adc-tm5/hc: Clean up examples 2024-01-02 09:33:18 +01:00
qcom-spmi-adc-tm5.yaml dt-bindings: thermal: qcom-spmi-adc-tm5/hc: Clean up examples 2024-01-02 09:33:18 +01:00
qcom-tsens.yaml dt-bindings: thermal: qcom-tsens: document the SM8650 Temperature Sensor 2024-01-02 09:33:18 +01:00
qoriq-thermal.yaml dt-bindings: thermal: Drop unneeded quotes 2023-04-07 11:18:28 +02:00
rcar-gen3-thermal.yaml dt-bindings: thermal: rcar-gen3-thermal: Add r8a779g0 support 2023-02-15 17:28:51 +01:00
rcar-thermal.yaml dt-bindings: Fix incorrect "the the" corrections 2022-08-18 10:59:33 -07:00
rockchip-thermal.yaml dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible 2023-04-07 10:31:33 +02:00
rzg2l-thermal.yaml dt-bindings: thermal: rzg2l-thermal: Document RZ/Five SoC 2022-12-14 15:25:41 +01:00
samsung,exynos-thermal.yaml dt-bindings: update Krzysztof Kozlowski's email 2022-04-04 15:43:20 +02:00
socionext,uniphier-thermal.yaml dt-bindings: thermal: Fix node descriptions in uniphier-thermal example 2022-12-26 16:09:29 -06:00
spear-thermal.txt
sprd-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
st,stm32-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
st-thermal.txt
thermal-cooling-devices.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-idle.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-sensor.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
thermal-zones.yaml dt-bindings: thermal-zones: Document critical-action 2024-01-02 09:33:18 +01:00
ti,am654-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
ti,j72xx-thermal.yaml dt-bindings: drop redundant part of title (end, part three) 2022-12-16 11:41:49 -06:00
ti_soc_thermal.txt