Having all zero cstate count doesn't necesserily mean the cstate
counter is no functional.
Signed-off-by: Yuxuan Shui <yshuiv7@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Thermal sensor needs pll3_usb_otg when measuring temperature,
otherwise the temperature read will be incorrect, so need to
enable this clk before sensor working, for alarm function,
as hardware will take measurement periodically, so we should
keep this clk always on once alarm function is enabled.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
As per Documentation/thermal/sysfs-api.txt, max_level
is an index, not a counter. Thus, in case a CPU has
3 valid frequencies, max_level is expected to be 2, for instance.
The current code makes max_level == number of valid frequencies,
which is bogus. This patch fix the cpu_cooling device by
ranging max_level properly.
Reported-by: Carlos Hernandez <ceh@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Add the module device table declaration so the module can be loaded
automatically at boot time.
Signed-off-by: Russell King <rmk+kernel@arm.linux.org.uk>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Mark function sys_set_trip_temp() as static in x86_pkg_temp_thermal.c
because it is not used outside this file.
This eliminates the following warning in x86_pkg_temp_thermal.c:
drivers/thermal/x86_pkg_temp_thermal.c:218:5: warning: no previous prototype for ‘sys_set_trip_temp’ [-Wmissing-prototypes]
Signed-off-by: Rashika Kheria <rashika.kheria@gmail.com>
Reviewed-by: Josh Triplett <josh@joshtriplett.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch fixes a compilation warning.
warning: passing argument 5 of 'thermal_zone_device_register' discards 'const'
qualifier from pointer target type [enabled by default]
include/linux/thermal.h:270:29: note: expected 'struct thermal_zone_device_ops *'
but argument is of type 'const struct thermal_zone_device_ops *'
Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Fixes regression introduced by:
commit 37713a1e8e
Author: Philipp Zabel <p.zabel@pengutronix.de>
Date: Thu Aug 1 18:33:12 2013 +0200
thermal: imx: implement thermal alarm interrupt handling
The commit 37713a1e8e makes imx thermal sensor always powered up as alarm
function is enabled, but the suspend callback of imx thermal returns
success only if thermal sensor is powered down, so it will always returns
fail hence break system's suspend, this patch disables imx thermal sensor
before suspend and re-enable it after resume.
Signed-off-by: Anson Huang <b20788@freescale.com>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Set the return variable to an error code as done elsewhere in the function.
A simplified version of the semantic match that finds this problem is as
follows: (http://coccinelle.lip6.fr/)
// <smpl>
(
if@p1 (\(ret < 0\|ret != 0\))
{ ... return ret; }
|
ret@p1 = 0
)
... when != ret = e1
when != &ret
*if(...)
{
... when != ret = e2
when forall
return ret;
}
// </smpl>
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Reviewed-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
People seem to delight in writing wrong and broken mwait idle routines;
collapse the lot.
This leaves mwait_play_dead() the sole remaining user of __mwait() and
new __mwait() users are probably doing it wrong.
Also remove __sti_mwait() as its unused.
Cc: Arjan van de Ven <arjan@linux.intel.com>
Cc: Jacob Jun Pan <jacob.jun.pan@linux.intel.com>
Cc: Mike Galbraith <bitbucket@online.de>
Cc: Len Brown <lenb@kernel.org>
Cc: Rui Zhang <rui.zhang@intel.com>
Acked-by: Rafael Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Peter Zijlstra <peterz@infradead.org>
Link: http://lkml.kernel.org/r/20131212141654.616820819@infradead.org
Signed-off-by: H. Peter Anvin <hpa@linux.intel.com>
This patch improves the ti-soc-thermal driver by adding the
support to build the thermal zones based on DT nodes.
The driver will have two options now to build the thermal
zones. The first option is the zones originally coded
in this driver. So, the driver behavior will be same
if there is no DT node describing the zones. The second
option, when it is found a DT node with thermal data,
will used the common infrastructure to build the thermal
zone and bind its cooling devices.
In case the driver loads thermal data using the legacy
mode, this driver still adds to the system
a cpufreq cooling device. Loading the thermal data from
DT, the driver assumes someone else will add the cpufreq
cooling device, like the cpufreq driver.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch introduces an API to register cpufreq cooling device
based on device tree node.
The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds a new API to allow registering cooling devices
in the thermal framework derived from device tree nodes.
This API links the cooling device with the device tree node
so that binding with thermal zones is possible, given
that thermal zones are pointing to cooling device
device tree nodes.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.
This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.
This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.
Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch changes the thermal core driver to allow
registration of thermal zones without the .get_temp callback.
The idea behind this change is to allow lazy registration
of sensor callbacks.
The thermal zone will be disabled whenever the ops
does not contain a .get_temp callback. The sysfs interface
will be returning -EINVAL on any temperature read operation.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Pull networking fixes from David Miller:
"Mostly these are fixes for fallout due to merge window changes, as
well as cures for problems that have been with us for a much longer
period of time"
1) Johannes Berg noticed two major deficiencies in our genetlink
registration. Some genetlink protocols we passing in constant
counts for their ops array rather than something like
ARRAY_SIZE(ops) or similar. Also, some genetlink protocols were
using fixed IDs for their multicast groups.
We have to retain these fixed IDs to keep existing userland tools
working, but reserve them so that other multicast groups used by
other protocols can not possibly conflict.
In dealing with these two problems, we actually now use less state
management for genetlink operations and multicast groups.
2) When configuring interface hardware timestamping, fix several
drivers that simply do not validate that the hwtstamp_config value
is one the driver actually supports. From Ben Hutchings.
3) Invalid memory references in mwifiex driver, from Amitkumar Karwar.
4) In dev_forward_skb(), set the skb->protocol in the right order
relative to skb_scrub_packet(). From Alexei Starovoitov.
5) Bridge erroneously fails to use the proper wrapper functions to make
calls to netdev_ops->ndo_vlan_rx_{add,kill}_vid. Fix from Toshiaki
Makita.
6) When detaching a bridge port, make sure to flush all VLAN IDs to
prevent them from leaking, also from Toshiaki Makita.
7) Put in a compromise for TCP Small Queues so that deep queued devices
that delay TX reclaim non-trivially don't have such a performance
decrease. One particularly problematic area is 802.11 AMPDU in
wireless. From Eric Dumazet.
8) Fix crashes in tcp_fastopen_cache_get(), we can see NULL socket dsts
here. Fix from Eric Dumzaet, reported by Dave Jones.
9) Fix use after free in ipv6 SIT driver, from Willem de Bruijn.
10) When computing mergeable buffer sizes, virtio-net fails to take the
virtio-net header into account. From Michael Dalton.
11) Fix seqlock deadlock in ip4_datagram_connect() wrt. statistic
bumping, this one has been with us for a while. From Eric Dumazet.
12) Fix NULL deref in the new TIPC fragmentation handling, from Erik
Hugne.
13) 6lowpan bit used for traffic classification was wrong, from Jukka
Rissanen.
14) macvlan has the same issue as normal vlans did wrt. propagating LRO
disabling down to the real device, fix it the same way. From Michal
Kubecek.
15) CPSW driver needs to soft reset all slaves during suspend, from
Daniel Mack.
16) Fix small frame pacing in FQ packet scheduler, from Eric Dumazet.
17) The xen-netfront RX buffer refill timer isn't properly scheduled on
partial RX allocation success, from Ma JieYue.
18) When ipv6 ping protocol support was added, the AF_INET6 protocol
initialization cleanup path on failure was borked a little. Fix
from Vlad Yasevich.
19) If a socket disconnects during a read/recvmsg/recvfrom/etc that
blocks we can do the wrong thing with the msg_name we write back to
userspace. From Hannes Frederic Sowa. There is another fix in the
works from Hannes which will prevent future problems of this nature.
20) Fix route leak in VTI tunnel transmit, from Fan Du.
* git://git.kernel.org/pub/scm/linux/kernel/git/davem/net: (106 commits)
genetlink: make multicast groups const, prevent abuse
genetlink: pass family to functions using groups
genetlink: add and use genl_set_err()
genetlink: remove family pointer from genl_multicast_group
genetlink: remove genl_unregister_mc_group()
hsr: don't call genl_unregister_mc_group()
quota/genetlink: use proper genetlink multicast APIs
drop_monitor/genetlink: use proper genetlink multicast APIs
genetlink: only pass array to genl_register_family_with_ops()
tcp: don't update snd_nxt, when a socket is switched from repair mode
atm: idt77252: fix dev refcnt leak
xfrm: Release dst if this dst is improper for vti tunnel
netlink: fix documentation typo in netlink_set_err()
be2net: Delete secondary unicast MAC addresses during be_close
be2net: Fix unconditional enabling of Rx interface options
net, virtio_net: replace the magic value
ping: prevent NULL pointer dereference on write to msg_name
bnx2x: Prevent "timeout waiting for state X"
bnx2x: prevent CFC attention
bnx2x: Prevent panic during DMAE timeout
...
Register generic netlink multicast groups as an array with
the family and give them contiguous group IDs. Then instead
of passing the global group ID to the various functions that
send messages, pass the ID relative to the family - for most
families that's just 0 because the only have one group.
This avoids the list_head and ID in each group, adding a new
field for the mcast group ID offset to the family.
At the same time, this allows us to prevent abusing groups
again like the quota and dropmon code did, since we can now
check that a family only uses a group it owns.
Signed-off-by: Johannes Berg <johannes.berg@intel.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
This doesn't really change anything, but prepares for the
next patch that will change the APIs to pass the group ID
within the family, rather than the global group ID.
Signed-off-by: Johannes Berg <johannes.berg@intel.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
Pull thermal management updates from Zhang Rui:
"This time we only have a few changes as there are no soc thermal
changes from Eduardo. The only big change is the introduction of
TMON, a tool to help visualize, tune, and test the thermal subsystem.
The rest is mostly cleanups and fixes all over.
Specifics:
- introduce TMON, a tool base on thermal sysfs I/F. It can be used
to visualize, tune and test the thermal subsystem.
- fix a zone/cooling device binding problem, when both thermal zone
bind parameters and .bind() callback are available"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
tools/thermal: Introduce tmon, a tool for thermal subsystem
thermal: Fix binding problem when there is thermal zone params
thermal: cpu_cooling: fix return value check in cpufreq_cooling_register()
Thermal: Check for validity before doing kfree
thermal/intel_powerclamp: Add newer CPU models
Thermal: Tidy up error handling in powerclamp_init
thermal: Kconfig: cosmetic fixes
ACPI/thermal : Remove zone disabled warning
typo in drivers/thermal/Kconfig: lpatform instead of platform
The thermal zone params can be used to set governor
to specific thermal governor for thermal zone device.
But if the thermal zone params has only governor name
without thermal bind params, then the thermal zone device
will not be binding to cooling device. Because tz->ops->bind
operator is not invoked in bind_tz() and bind_cdev() when
there is thermal zone params.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Jinyoung Park <jinyoungp@nvidia.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In case of error, the function thermal_cooling_device_register() returns
ERR_PTR() and never returns NULL. The NULL test in the return value check
should be replaced with IS_ERR().
Signed-off-by: Wei Yongjun <yongjun_wei@trendmicro.com.cn>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
* pm-cpufreq: (167 commits)
cpufreq: create per policy rwsem instead of per CPU cpu_policy_rwsem
intel_pstate: Add Baytrail support
intel_pstate: Refactor driver to support CPUs with different MSR layouts
cpufreq: Implement light weight ->target_index() routine
PM / OPP: rename header to linux/pm_opp.h
PM / OPP: rename data structures to dev_pm equivalents
PM / OPP: rename functions to dev_pm_opp*
cpufreq / governor: Remove fossil comment
cpufreq: exynos4210: Use the common clock framework to set APLL clock rate
cpufreq: exynos4x12: Use the common clock framework to set APLL clock rate
cpufreq: Detect spurious invocations of update_policy_cpu()
cpufreq: pmac64: enable cpufreq on iMac G5 (iSight) model
cpufreq: pmac64: provide cpufreq transition latency for older G5 models
cpufreq: pmac64: speed up frequency switch
cpufreq: highbank-cpufreq: Enable Midway/ECX-2000
exynos-cpufreq: fix false return check from "regulator_set_voltage"
speedstep-centrino: Remove unnecessary braces
acpi-cpufreq: Add comment under ACPI_ADR_SPACE_SYSTEM_IO case
cpufreq: arm-big-little: use clk_get instead of clk_get_sys
cpufreq: exynos: Show a list of available frequencies
...
Conflicts:
drivers/devfreq/exynos/exynos5_bus.c
Commit b82715fdd4 introduces
a 'device' subdirectory under /sys/class/hwmon/hwmonX/ directory,
for the thermal_zone hwmon devices. And this results in different
handling by libsensors.
The problem is reported and discussed in this thread
http://marc.info/?l=linux-pm&m=138229306109596&w=2
This patch reverts commit b82715fdd4.
Reported-by: Arnaud Ebalard <arno@natisbad.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
CONFIG_CPU_FREQ_TABLE will be always enabled when cpufreq framework is used, as
cpufreq core depends on it. So, we don't need this CONFIG option anymore as it
is not configurable. Remove CONFIG_CPU_FREQ_TABLE and update its users.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
This patch changes the behavior of TI SoC thermal driver
when there is a PCB thermal zone.
Instead of reporting an error code when reading from
PCB temperature sensor fails, this patch will make
the driver attempt to compose the hotspot extrapolation
based on bandgap readings only.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
The commit d0a0ce3e77 ("thermal: exynos: Add
missing definations and code cleanup") has removed setting of test MUX address
value at TMU configuration setting.
This field is not present on Exynos4210 and Exynos5 SoCs. However on Exynos4412
SoC it is required to set this field after reset because without it TMU shows
maximal available temperature, which causes immediate platform shutdown.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Up till now Exynos5250 and Exynos4412 had the same definitions for TMU
data. Following commit changes that, by introducing separate
exynos4412_default_tmu_data structure.
Since Exynos4412 was chronologically first, the corresponding name for
TMU registers and default data was renamed.
Additionally, new SOC_ARCH_EXYNOS4412 type has been defined.
Moreover, the SOC_ARCH_EXYNOS name has been changed to SOC_ARCH_EXYNOS5250.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
The commit 4de0bdaa96
("thermal: exynos: Add support for instance based register/unregister")
broke check for presence of therm_dev at global thermal zone in
exynos_report_trigger().
The resulting wrong test prevents thermal_zone_device_update() call, which
calls handlers for situation when trip points are passed.
Such behavior prevents thermal driver from proper reaction (when TMU interrupt
is raised) in a situation when overheating is detected at TMU hardware.
It turns out, that after exynos thermal subsystem redesign (at v3.12) this
check is not needed, since it is not possible to register thermal zone
without valid thermal device.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
The thermal_release function is called whenever
any device belonging to 'thermal' class unregisters.
This function performs kfree(cdev) without any check.
In cases where there are more device registrations
other than just 'thermal_zone' and 'cooling_device'
this might accidently free memory allocated them
silently; and cause memory errors.
This patch changes this behavior by doing
kfree(cdev) only when the device pointer belongs
to a real cdev i.e. cooling_device.
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This will enable intel_powerclamp driver on newer Intel CPUs
including some Ivy Bridge and Haswell processors.
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch
* adds missing kfree() for cpu_clamping_mask
* adds return value checking for alloc_percpu()
* unregister hotcpu notifier in exit path
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
x86_pkg_temp receives thermal notifications via a callback from a
therm_throt driver, where thermal interrupts are processed.
This callback is pkg_temp_thermal_platform_thermal_notify. Here to
avoid multiple interrupts from cores in a package, we disable the
source and also set a variable to avoid scheduling delayed work function.
This variable is protected via spin_lock_irqsave. On one buggy platform,
we still receiving interrupts even if the source is disabled. This
can cause deadlock/lockdep warning, when interrupt is generated while under
spinlock in work function.
Change spin_lock to spin_lock_irqsave and spin_unlock to
spin_unlock_irqrestore as the data it is trying to protect can also
be modified in a notification call called from interrupt handler.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This patch avoids NULL pointer accesses while unregistering
cpu cooling devices, in case a NULL pointer is received.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).
This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.
This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.
In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.
Cc: David Woodhouse <dwmw2@infradead.org>
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Suggested-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
When creating virtual hwmon devices based out of thermal
zone devices, the virtual devices won't have parents.
This patch changes the code so that the parent of virtual
hwmon devices is the thermal zone device that they are
based of.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.
In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Commit 1cd1ecb6 ("thermal: exynos: Remove non DT based support")
cleaned up some non-DT code. However, there were few more things
needed for complete cleanup to make this driver DT only.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
NULL pointer was being dereferenced in its own error message.
Changed it to the correct device pointer.
Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Workaround to compute thermal trend even when update interval
is not set. This patch will ensure to compute the thermal trend
when bandgap counter delay is not set.
Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Set the bandgap mask counter_delay with the polling_delay value on
registering the thermal zone. This patch will ensure to get the
correct update interval for computing the thermal trend.
Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
In case the trend is not changing or when there is no
request for throttling, it is expected that the instance
would not change its requested target. This patch improves
the code implementation to cover for this expected behavior.
With current implementation, the instance will always
reset to cdev.cur_state, even in not expected cases,
like those mentioned above.
This patch changes the step_wise governor implementation
of get_target so that we accomplish:
(a) - default value will be current instance->target, so
we do not change the thermal instance target unnecessarily.
(b) - the code now it is clear about what is the intention.
There is a clear statement of what are the expected outcomes
(c) - removal of hardcoded constants, now it is put in use
the THERMAL_NO_TARGET macro.
(d) - variable names are also improved so that reader can
clearly understand the difference between instance cur target,
next target and cdev cur_state.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Reported-by: Ruslan Ruslichenko <ruslan.ruslichenko@ti.com>
Signed-of-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The cooling device only needs update on a new target state. Since we
already check old target in thermal_zone_trip_update(), we can do one
more check to see if it's a new target state. If not, we can reasonably
save some uncecesary code execution.
Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
cpufreq_thermal_notifier() is to change the cpu's cpufreq in the allowed_cpus mask
when associated thermal-cpufreq cdev's cooling state is changed. It's a cpufreq policy
notifier handler and it will be triggered even if those cpus out of allowed_cpus has
changed freq policy.
cpufreq_thermal_notifier() checks the policy->cpu. If it belongs to allowed_cpus,
change max_freq(default to 0) to the desire cpufreq value and pass 0 and max_freq
to cpufreq_verify_within_limits() as cpufreq scope. But if not, do nothing and
max_freq will remain 0. This will cause the cpufreq scope to become 0~0. This
is not right. This patch is to return directly after finding cpu not belonging
to allowed_cpus.
Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
The error check is checking for a "base" mapped memory base
instead of "base_common". Fixing the same.
Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Enable automatic measurements at 10 Hz and use the alarm interrupt to react
more quickly to sudden temperature changes above the passive or critical
temperature trip points.
Signed-off-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Set passive and critical trip point values depending on the maximum die
temperature stored in the OCOTP fuses. This allows higher trip points
for industrial and automotive rated i.MX6 SoCs.
Also allow to configure the passive trip point from userspace.
Signed-off-by: Philipp Zabel <p.zabel@pengutronix.de>
Acked-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
TMU probe function now checks for a device tree defined regulator.
For compatibility reasons it is allowed to probe driver even without
this regulator defined.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds support for h/w mode calibration in the TMU controller.
Soc's like 5440 support this features. The h/w bits needed for calibration
setting are same as that of enum calibration_type.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch sets the second point trimming value according to the platform
data if the register value is 0.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds configuration data for exynos5440 soc. Also register
definations for the controller are added.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch modifies TMU controller to add changes needed to work with
exynos5440 platform. This sensor registers 3 instance of the tmu controller
with the thermal zone and hence reports 3 temperature output. This controller
supports upto five trip points. For critical threshold the driver uses the
core driver thermal framework for shutdown.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Jungseok Lee <jays.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds support to parse one more common set of TMU register. First
set of register belongs to each instance of TMU and second set belongs to
common TMU registers.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch uses the device pointer stored in the configuration structure
and converts to dev_* prints and devm API's.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds several features supported by TMU as bitfields.
This features varies across different SOC type and comparing
the features present in the TMU is more logical than comparing
the soc itself.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds support to handle multiple instances of the TMU controllers.
This is done by removing the static structure to register with the core thermal
and creating it dynamically for each instance of the TMU controller. The
interrupt is made shared type to handle shared interrupts. Now since the ISR needs
the core thermal framework to be registered so request_irq is moved after the core
registration is done.
Also the identifier of the TMU controller is extracted from device tree alias. This
will be used for TMU specific initialisation.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Recently non DT support from Exynos platform is removed and hence
removing non DT support from the driver also. This will help in easy
maintainence.
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code simplifies the zone handling to use the trip information passed
by the TMU driver and not the hardcoded macros. This also helps in adding
more zone support.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch removes the error return in the bind/unbind routine
as the platform may not register any cpufreq cooling data.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch renames member private_data to driver_data of the thermal
zone registration structure as this item stores the driver related
data and uses it to call the driver related callbacks.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code modifies the thermal driver to have multiple thermal zone
support by replacing the global thermal zone variable with device data
member of thermal_zone_device.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch uses the TMU status register to know the generated interrupts
and only clear them in the interrupt handler.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
TMU urgently sends active-high signal (thermal trip) to PMU, and thermal
tripping by hardware logic. Thermal tripping means that PMU cuts off the
whole power of SoC by controlling external voltage regulator.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Jonghwan Choi <jhbird.choi@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch migrates the TMU register definition/bitfields to data file. This
is needed to support SoC's which use the same TMU controller but register
validity, offsets or bitfield may slightly vary across SOC's.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds entries min_efuse_value, max_efuse_value, default_temp_offset,
trigger_type, cal_type, trim_first_point, trim_second_point, max_trigger_level
trigger_enable in the TMU platform data structure. Also the driver is modified
to use the data passed by these new platform memebers instead of the constant
macros. All these changes helps in separating the SOC specific data part from
the TMU driver.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch adds some extra register bitfield definations and cleans
up the code to prepare for moving register macros and definations inside
the TMU data section. In this code cleanup the TMU enable bit is correctly used
as bit0 and bit1 is taken care which is reserve bit.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code splits the exynos tmu driver code into SOC specific data parts.
This will simplify adding new SOC specific data to the same TMU controller.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch renames and moves include/linux/platform_data/exynos_thermal.h to
drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos
SOC's are not supporting non-DT based platforms and this file now just contains
exynos tmu driver related definations.
Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes
the compilation issue occuring because now this new tmu header file is included
in tmu driver c file and not in the common thermal header file.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch renames exynos_thermal.c to exynos_tmu.c. This change is needed as
this file now just contains exynos tmu driver related codes and thermal zone
or cpufreq cooling registration related changes are not there anymore.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This code bifurcates exynos thermal implementation into common and sensor
specific parts. The common thermal code interacts with core thermal layer and
core cpufreq cooling parts and is independent of SOC specific driver. This
change is needed to cleanly add support for new TMU sensors.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch removes the dependency on CPU_THERMAL for compiling TMU driver.
This is useful for cases when only TMU controller needs to be initialised
without cpu cooling action.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This patch uses the recently added config sybmol ARCH_HAS_BANDGAP to enable
the TMU driver. This will allow adding support for new soc easily as now it
is the platform responsibility to enable this config symbol for a particular
soc.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid). Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.
It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs. The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.
Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Commit f1a18a105 "Thermal: CPU Package temperature thermal" had code
that did a get_online_cpus(), run a loop and then do a
put_online_cpus(). The problem is that the loop had an error exit that
would skip the put_online_cpus() part.
In the error exit part of the function, it also did a get_online_cpus(),
run a loop and then put_online_cpus(). The only way to get to the error
exit part is with get_online_cpus() already performed. If this error
condition is hit, the system will be prevented from taking CPUs offline.
The process taking the CPU offline will lock up hard.
Removing the get_online_cpus() removes the lockup as the hotplug CPU
refcount is back to zero.
This was bisected with ktest.
Signed-off-by: Steven Rostedt <rostedt@goodmis.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Although it is unlikley that physical package id is set to some
arbitary number, it is better to prevent in anycase. Since package
temp zones use this in thermal zone type and for allocation, added
a limit.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
If krealloc() returns NULL, it doesn't free the original. So any code
of the form 'foo = krealloc(foo, ...);' is almost certainly a bug.
Signed-off-by: Wei Yongjun <yongjun_wei@trendmicro.com.cn>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
On systems with no package MSR support this caused crash as there
is a bug in the logic to check presence of DTHERM and PTS feature
together. Added a change so that when there is no PTS support, module
doesn't get loaded. Even if some CPU comes online with the PTS
feature disabled, and other CPUs has this support, this patch
will still prevent such MSR accesses.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Reported-by: Daniel Walker <dwalker@fifo99.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Pull thermal management updates from Zhang Rui:
"There are not too many changes this time, except two new platform
thermal drivers, ti-soc-thermal driver and x86_pkg_temp_thermal
driver, and a couple of small fixes.
Highlights:
- move the ti-soc-thermal driver out of the staging tree to the
thermal tree.
- introduce the x86_pkg_temp_thermal driver. This driver registers
CPU digital temperature package level sensor as a thermal zone.
- small fixes/cleanups including removing redundant use of
platform_set_drvdata() and of_match_ptr for all platform thermal
drivers"
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
thermal: cpu_cooling: fix stub function
thermal: ti-soc-thermal: use standard GPIO DT bindings
thermal: MAINTAINERS: Add git tree path for SoC specific updates
thermal: fix x86_pkg_temp_thermal.c build and Kconfig
Thermal: Documentation for x86 package temperature thermal driver
Thermal: CPU Package temperature thermal
thermal: consider emul_temperature while computing trend
thermal: ti-soc-thermal: add DT example for DRA752 chip
thermal: ti-soc-thermal: add dra752 chip to device table
thermal: ti-soc-thermal: add thermal data for DRA752 chips
thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
thermal: ti-soc-thermal: freeze FSM while computing trend
thermal: ti-soc-thermal: remove external heat while extrapolating hotspot
thermal: ti-soc-thermal: update DT reference for OMAP5430
x86, mcheck, therm_throt: Process package thresholds
thermal: cpu_cooling: fix 'descend' check in get_property()
Thermal: spear: Remove redundant use of of_match_ptr
Thermal: kirkwood: Remove redundant use of of_match_ptr
Thermal: dove: Remove redundant use of of_match_ptr
Thermal: armada: Remove redundant use of of_match_ptr
...
This change updates the ti-soc-thermal driver to use
standard GPIO DT bindings to read the GPIO number associated
to thermal shutdown IRQ, in case the device features it.
Previously, the code was using a specific DT bindings.
As now OMAP supports the standard way to model GPIOs,
there is no point in having a ti specific binding.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
EXYNOS4212 and EXYNOS4412 have the same thermal block, so there is no
reason to include support only for EXYNOS4412 in this driver.
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Tomasz Figa <t.figa@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
Fix build error in x86_pkg_temp_thermal.c. It requires that
X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol,
since it depends on X86_MCE (indirectly).
Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block,
so remove that duplicated dependency.
ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!
ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!
Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Acked-by: Borislav Petkov <bp@suse.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
This driver register CPU digital temperature sensor as a thermal
zone at package level.
Each package will show up as one zone with at max two trip points.
These trip points can be both read and updated. Once a non zero
value is set in the trip point, if the package package temperature
goes above or below this setting, a thermal notification is
generated.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
In case emulated temperature is in use, using the trend
provided by driver layer can lead to bogus situation.
In this case, debugger user would set a temperature value,
but the trend would be from driver computation.
To avoid this situation, this patch changes the get_tz_trend()
to consider the emulated temperature whenever that is in use.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
